1
Power Supply with Integrated PassivEs - The EU FP7 PowerSwipe Project
Authors:
Mathuna, Cian O.; Wang, Ningning; Kulkarni, Santosh; Anthony, Ricky; Cordero, Nicolas; Oliver, Jesus; Alou, Pedro; Svikovic, Vladimir; Cobos, Jose Antonio; Cortes, Jorge; Neveu, Florian; Martin, Christian; Allard, Bruno; Voiron, Frederic; Knott, Bernhard; Sandner, Christoph; Maderbacher, Gerhard; Pichler, Joachim; Agostinelli, Matteo; Anca, Anamaria; Breig, Markus; Mathuna, Cian O.; Anthony, Ricky
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
2
Practical Aspects of Testing Methods for Thermal Interface Materials
Authors:
Saums, David L.
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
3
Present and Future of GaN Power Devices
Authors:
Ueda, Daisuke; Fukuda, Takeshi; Nagai, Shuichi; Sakai, Hiroyuki; Otsuka, Nobuyuki; Morita, Tatsuo; Negoro, Noboru; Ueda, Tetsuzo; Tanaka, Tsuyoshi
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
4
Probabilistic model based analysis of electrolytic capacitor ageing and failures in a single-phase power factor correction circuit
Authors:
Seliger, Norbert
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
5
Reliability assessment of molded Smart Power Modules
Authors:
Thomas, Tina; Becker, Karl-Friedrich; Dijk, Marius van; Wittler, Olaf; Braun, Tanja; Bauer, Joerg; Lang, Klaus-Dieter
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
6
Reliability of Sn based LT-TLPS Joints for High Temperature Electronic Systems
Authors:
Greve, Hannes; McCluskey, Patrick
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
7
Reliability Prediction Approach of DC-DC Converter with Electrical Stress Analysis
Authors:
Kim, Jemin; Choi, Sungsoon; Lee, Kwanhun; Lee, Kwanhun
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
8
Review of high frequency, highly integrated inductive DC-DC converters
Authors:
Neveu, F.; Martin, C.; Allard, B.
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
9
Robust Top Side Contact Technology on Power Semiconductors – Results from the Public Funded Project ‘ProPower’
Authors:
Rittner, Martin; Gross, David; Guyenot, Michael; Guenther, Michael; Haag, Sabine; Kaden, Thomas; Reinold, Manfred; Thoben, Markus; Stegmeier, Stefan; Weidner, Karl; Kock, Mathias
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
10
Robustness study of solder joints of different compositions by using Stochastic Finite Element Modeling
Authors:
Aoues, Younes; Makhloufi, Abderahman; Pougnet, Philippe; El-Hami, Abdelkhalak
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
11
Scalable high frequency converters for motor drives based on switching cells
Authors:
Schulz, Martin; Kapaun, Florian; Marquardt, Rainer
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
12
Simultaneous Testing of Wirebond and Solder Fatigue in IGBT Modules
Authors:
Riedel, G. J.; Valov, M.
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
13
Surface Profiles of Printed Ag Nanoparticle Paste and Their Implication on the Quality of Sintered Joints
Authors:
Wang, Yun; Li, Jianfeng; Agyakwa, Pearl; Johnson, Christopher Mark; Li, Shuguang; Wang, Yun; Wang, Yun
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
14
Switching-Frequency Limitations of a Three-Phase PWM Inverter using Si-MOSFETs and SiC-SBDs
Authors:
Wada, Keiji; Taguri, Kent
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
15
System Integration of GaN Converters – Paradigm Shift – Challenges and Opportunities
Authors:
Popovic, J.; Ferreira, J. A.; Wyk, J. D. van; Pansier, F.
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
16
Technology, industry and market trends in WBG power module packaging
Authors:
Roussel, Philippe; Azemar, Jerome
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
17
Temperature Humidity Bias (THB) Testing on IGBT Modules at High Bias Levels
Authors:
Zorn, Christian; Kaminski, Nando
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
18
Thermal path integrity monitoring for IGBT power electronics modules
Authors:
Eleffendi, Mohd. Amir; Johnson, C. Mark
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
19
Transient hygro-thermal-response of power modules in inverters – mission profiling for climate and power loading
Authors:
Bayerer, Reinhold; Lassmann, Matthias; Kremp, Sebastian
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
20
Ultra-low Power Autonomous Power Management System with Effective Impedance Matching for RF Energy Harvesting
Authors:
Adami, Salah-Eddine; Vollaire, Christian; Allard, Bruno; Costa, François; Haboubi, Walid; Cirio, Laurent
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems