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21

Benchmark of the gate driver supplies' architectures for "N" power devices in series connection

Authors:
Nguyen, Van-Sang; Lefranc, Pierre; Crebier, Jean-Christophe
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

22

Benefits of new CoolSiCTM MOSFET in HybridPACKTM Drive package for electrical drive train applications.

Authors:
Jakobi, Waldemar; Uhlemann, Andre; Thoben, Markus; Schweikert, Christian; Strenger, Christian; Pai, Ajay Poonjal; Beaurenaut, Laurent; Muenzer, Mark
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

23

C-V Characterization Technique for Four-Terminal GaN-on-Si HEMTs Based on 3-Port S-Parameter Measurements

Authors:
Salcinesa, Cristino; Moench, Stefan; Spudic, Boris; Kallfass, Ingmar
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

24

Characterization of ferrite core properties for FM-band filtering in automotive applications

Authors:
Boenisch, Sven; Hoffmann, Stefan; Hoene, Eckart; Schmidhuber, Michael
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

25

Comparison of the Surge Current Ruggedness between the Body Diode of SiC MOSFETs and Si Diodes for IGBT

Authors:
Hofstetter, Patrick; Bakran, Mark-M.
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

26

Comparison of thermal and reliability performance between a SiC MOSFET module with embedded decoupling capacitors and commercial Si IGBT power modules

Authors:
Yang, Li; Agyakwa, Pearl; Corfield, Martin; Johnson, Mark; Harris, Anne; Packwood, Matthew; Paciura, Krzysztof
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

27

Condition and Health Monitoring in Power Electronics

Authors:
Mollov, Stefan; Blaabjerg, Frede
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

28

Current filament monitoring under unclamped inductive switching conditions on real IGBT interconnection

Authors:
Tsukuda, Masanori; Arimoto, Takaaki; Omura, Ichiro
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

29

Design and Fabrication of PCB Embedded Power Module with Integrated Heat Exchanger for Dielectric Coolant

Authors:
Schnur, Johann; Sharma, Ankit Bhushan; Haag, Niko; Kuwan, Thomas; Stogel, Armin; Huesgen, Till
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

30

Design of a low inductive switching cell dedicated to SiC based Current Source Inverter (CSI)

Authors:
Lefevre, Guillaume
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

31

Die-bonding performance of micron Ag particle paste for high power devices

Authors:
Takemasa, Tetsu; Ueshima, Minoru; Jiu, Jinting; Seino, Junko; Suganuma, Katsuaki
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

32

Dielectric Properties and Partial Discharge Inception Voltage of Aluminum Nitride Insulating Substrate at High Temperatures

Authors:
Abe, Tsuyoshi; Suenaga, Michiya; Akihiro Imakiire; Kozako, Masahiro; Hikita, Masayuki; Shiota, Hiroki; Nishimura, Takashi; Muto, Hirotaka
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

33

Direct Copper Bonding (DCB) alumina substrates with preapplied solder pads for simplified die soldering and improved manufacturing yield

Authors:
Richter, Hans-Juergen; Liu, Pan; Schaefer, Michael; Fritzsche, Sebastian; Watzal, Dieter; Fery, Christophe
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

34

Direct Pressed Die (DPD) Technology - a Novel Packaging Solution for Power Modules

Authors:
Goebl, Christian; Bellu, R.; Vennebusch, C.
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

35

Double chips low side - high side configurable full gate driver circuits for high speed inverter leg

Authors:
Crebier, Jean-Christophe; Nguyen, Van-Sang; Lefranc, Pierre; Rouger, Nicolas; Grezaud, Romain; Ayel, Francois; Saboret, Xavier; Latimier, Paul-Emile
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

36

Effects of different working frequencies on the joint formation in copper wire bonding

Authors:
Schemmel, Reinhard; Althoff, Simon; Sextro, Walter; Unger, Andreas; Hunstig, Matthias; Broekelmann, Michael
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

37

Electrochemical Corrosion on Ceramic Substrates for Power Electronics – Causes, Phenomenological Description, and Outlook

Authors:
Bayer, Christoph Friedrich; Diepgen, Antonia; Filippi, Thomas; Fuchs, Carmen; Wuestefeld, Sophie; Kellner, Simon; Waltrich, Uwe; Schletz, Andreas
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

38

Electromagnetic noise induced by novel high voltage fast switching device

Authors:
Funaki, Tsuyoshi
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

39

Experimentally-Validated Models of On-State Voltage for Remaining Useful Life Estimation and Design for Reliability of Power Modules

Authors:
Degrenne, Nicolas; Mollov, Stefan
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

40

Fabrication and Characterization of a High-Power-Density, Planar 10 kV SiC MOSFET Power Module

Authors:
DiMarino, Christina; Johnson, Mark; Mouawad, Bassem; Li, Jianfeng; Skuriat, Robert; Wang, Meiyu; Tan, Yansong; Lu, G. Q.; Boroyevich, Dushan; Burgos, Rolando
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems