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61

Surface adsorption mechanism of water-soluble polymer in polishing slurry

Autoren:
Tsuchiya, Kohsuke; Takahashi, Shuhei; Kubo, Megumi; Morinaga, Hitoshi
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

62

The effect of H2O2 and Ammonia sulfate on the CMP of Molybdenum

Autoren:
Chen, Fei; Zeng, Xu; Xu, Jing-Bo; Lu, Hai-Sheng; Qu, Xin-Ping
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

63

The Study of POU Filters Performance and Life-time in the CMP Slurry Supply System

Autoren:
Jang, Sunjae; Lim, Donghyun; Ji Chul Yang; Kim, Hojoong; Nam, Miyeon; Kim, Taesung
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

64

The Study to Minimize the Variation of Polishing Time According to the Pad Used Time

Autoren:
Yang, Ji Chul; Jang, Won Moon; Won, Jae-Hyung
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

65

The Synergetic Effect of Polishing Debris Cleaning in Real-time

Autoren:
Kim, Hojoong; Kim, Mingu; Qin, Hongyi; Yang, Ji Chul; Lim, Donghyun; Choi, Hoomi; Kim, Taesung
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

66

The Synthesis of PS-Si02 Raspberry Structure Nanopartide for CMP Slurry

Autoren:
Qin, Hongyi; Kim, Hojoong; Choi, Hoomi; Kim, Mingu; Kim, Taesung
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

67

Topography Understanding of Tungsten Chemical Mechanical Polishing for Advanced Technology

Autoren:
Yu, Hong; Moon, Yongsik; Liu, Huang
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

68

Tribological, Thermal, and Kinetic Attributes of 300 vs. 450 mm Chemical Mechanical Planarization Processes

Autoren:
Jiao, Yubo; Liao, Xiaoyan; Wu, Changhong; Zhuang, Yun; Sampurno, Yasa; Theng, Siannie; Godlstein, Michael; Philipossian, Ara
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

69

TSV CMP Process Development and Pitting Defect Reduction

Autoren:
Lin, Paul-Chang; Xu, Jinhai; Li, Pei; Ding, Yujie; Ma, Zhiyong; Xing, Charles; Jing, Judy; Wang, Yuchun
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology