1
High temperature thermal cycling performance of DBA, AMB and thick film power module substrates
Autoren:
Hamilton, Dean. P.; Riches, Steve; Meisser, Michael; Mills, Liam; Mawby, Philip
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
2
High temperature thermal cycling reliability of silver sintered and electroplated tin based transient liquid phase joints
Autoren:
Hamilton, Dean. P.; Syed-Khaja, Aarief; Franke, Joerg; Mawby, Philip
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
3
Highly integrated SiC module with thick-film dielectric allows for high frequency operation
Autoren:
Meisser, Michael; Schmenger, Max; Bernd, Martin; Leyrer, Benjamin; Demattio, Horst; Hamilton, Dean; Mawby, Philip; Blank, Thomas
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
4
IGBT Online-Temperature Monitoring using Turn-Off Delay as a Temperature Sensitive Electrical Parameter
Autoren:
Felgemacher, Christian; Dombert, Benjamin; Noeding, Christian; Zacharias, Peter
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
5
Influence of the Magnetic’s Parasitic Capacitance in the switching of High-Voltage Cascode GaN HEMT
Autoren:
Galanos, N.; Popovic, J.; Ferreira, J. A.; Gerber, M.
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
6
Influence of wire material and diameter on the reliability of Al-H11, Al-CR, Al-R and AlX heavy wire bonds during power cycling
Autoren:
Ehrhardt, Christian; Geissler, Ute; Hoefer, Jan; Broll, Marian; Schneider-Ramelow, Martin; Lang, Klaus-Dieter; Schmitz, Stefan
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
7
Innovative monolithic RC-snubber for fast switching power modules
Autoren:
Krach, Florian; Heckel, Thomas; Frey, Lothar; Bauer, Anton J.; Erlbacher, Tobias; Maerz, Martin
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
8
Integrated converter network for active balancing structure of battery
Autoren:
Phung, Thanh Hai; Mestrallet, Fabien; Vladimirova, Kremena; Collet, Alexandre; Kerachev, Lyubomir; Lembeye, Yves; Crebier, Jean-Christophe
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
9
Integrated High-Temperature Isolation barrier with Coreless Transformer
Autoren:
Perrin, Remi; Allard, Bruno; Martin, Christian; Buttay, Cyril
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
10
Investigation of a power module with double sided cooling using a new concept for chip embedding
Autoren:
Stahr, H.; Morianz, M.; Gross, S.; Unger, M.; Nicolics, J.; Boettcher, L.
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
11
Investigations of Power Semiconductor Modules using Conductive Adhesive for Chip Assembly
Autoren:
Grieger, Folkhart; Middelstaedt, Lars; Lindemann, Andreas; Moeller, Eike; Wilde, Juergen
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
12
Life-time modeling of DBC-based MOSFET-power modules
Autoren:
Faust-Ellsaesser, Carmen; Proepper, Thomas; Riester, Konrad; Duerr, Johannes
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
13
Lifetime Analysis of IGBTs in Periodic Surge Current Operation
Autoren:
Kemper, J.; Nevoigt, J.; Huebner, H.; Hoffmann, K.
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
14
Loss evaluation of GaN GIT in a high frequency boost converter in different operation modes
Autoren:
Wang, Wenbo; Pansier, Frans; Popovic, Jelena; Ferreira, J. A.
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
15
Low inductance 2.5 kV packaging technology for SiC switches
Autoren:
Mouawad, Bassem; Li, Jianfeng; Castellazzi, Alberto; Johnson, C. Mark; Erlbacher, Tobias; Friedrichs, Peter
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
16
Low Temperature Bonding Technology for 250 °C-Operating SiC Power Modules Using Nano-Composite Cu/Sn Paste
Autoren:
Lang, Fengqun; Kato, Fumiki; Nakagawa, Hiroshi; Yamaguchi, Hiroshi; Sato, Hiroshi; Kimura, Ryuji; Ikeda, Hiroaki; Shimokawa, Koichi; Tamaki, Rei; Sekine, Shigenobu
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
17
Low Temperature Silver Sinter Processes on ENIG Surfaces
Autoren:
Blank, T.; Bruns, M.; Kuebel, C.; Leyrer, B.; Meisser, M.; Weber, M.; Rudzki, J.; Osterwald, F.; Wilke, K.; Busche, N.; Eisele, R.
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
18
Magnetic flux signal simulation with 16-channel sensor array to specify accurate IGBT current distribution
Autoren:
Tsukuda, M.; Matsuo, K.; Tomonaga, H.; Okoda, S.; Noda, R.; Tashiro, K.; Omura, I.
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
19
Magnetoresistive current sensors as an enabling technology for ultra-high power density electric drives
Autoren:
Slatter, Rolf; Brusius, Matthias; Knoll, Heiko
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
20
Mechanical properties of silver sintered bond lines: Aspects for a reliable material data base for numerical simulations
Autoren:
Letz, Sebastian; Hutzler, Aaron; Waltrich, Uwe; Zischler, Sigrid; Schletz, Andreas
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems