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61

Multi-chip Medium Voltage SiC MOSFET Power Module with Focus on Low Parasitic Capacitance

Autoren:
Jorgensen, Jannick K.; Dalal, Dipen Narendra; Beczkowski, Szymon; Munk-Nielsen, Stig; Uhrenfeldt, Christian
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

62

Novel back-end-of-line compatible method for integration of inductances with magnetic core on silicon

Autoren:
Paesler, Malte; Lisec, Thomas; Kapels, Holger
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

63

Numerical material design for reliable power electronics with cement-based encapsulation

Autoren:
Naumann, Falk; Boettge, Bianca; Behrendt, Stefan; Eisele, Ronald; Klengel, Sandy
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

64

Operating a du/dt Filter with a SiC Halfbridge Module and Integrated Active Snubber

Autoren:
Schlueter, Michael; Pfost, Martin
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

65

Optimisation and Proof of Concept Studies for the M-Shunt Structure applied to Printed Circuit Boards

Autoren:
Lutzen, Hauke; Mitsui, Koji; Silber, Dieter; Wada, Keiji; Kaminski, Nando
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

66

Paste Processing and Structural Properties of Copper Metal-Matrix Composites Containing Short Carbon Fibers

Autoren:
Wurst, Helge; Blank, Thomas; Leyrer, Benjamin; Weber, Marc; Ishikawa, Dai
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

67

PCB Embedded dies for low thickness Wireless rotary transformer

Autoren:
Perrin, Remi; Mariani, Guilherme Bueno; Morand, Julien; Mollov, Stefan
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

68

PCB Embedded Toroidal Inductor for 2MHz Point-of-Load Converter

Autoren:
Murphy, Ruaidhri; Pavlovic, Zoran; McCloskey, Paul; O Mathuna, Cian; O’Driscoll, Seamus; Weidinger, Gerald
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

69

PCB Embedded Transformer for Isolated DC-DC Power Supplies

Autoren:
Weis, Gerald; Salkovic, Ivan
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

70

PCB Embedding using Single-Switch-Pre-Packages as Modular Building Blocks

Autoren:
Sharma, Ankit Bhushan; Schnur, Johann; Haag, Niko; Polezhaev, Vladimir; Huesgen, Till
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

71

PCB layout tool integrated loss and inductance estimation

Autoren:
Hoffmann, Stefan; Hoene, Eckart; Schroeder, Bernd; Stube, Bernd; Alraai, Akram; Moritz, Oliver; Mueller, Olaf
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

72

Power Cycle Testing at Low Temperature Swings – Evaluating the Stability of SAC- and SnSb-based Chip Solder Layers

Autoren:
Schmidt, Ralf; Kaesbauer, Michael; Sippel, Marcel; Dreher, Patrick
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

73

Power cycling close to 50- Hz load, low temperature swings combined with an adjustable part of switching losses

Autoren:
Seidel, Peter; Schwabe, Christian; Lutz, Josef
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

74

Power Cycling of SiC-MOSFET Single-Chip Modules with Additional Measurement Cycles for Life End Determination

Autoren:
Wagner, Felix; Reber, Gerhard; Rittner, Martin; Guyenot, Michael; Nitzsche, Maximilian; Wunderle, Bernhard
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

75

Power Cycling Reliability and Failure Modes in Power Modules with Novel Emitter Contact and Sintering Technologies

Autoren:
Beyer, Harald; Maleki, Milad; Bayer, Martin; Koenig, Swen; Fischer, Fabian; Paques, Gontran
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

76

Power cycling – methods, measurement accuracy, comparability

Autoren:
Lutz, Josef
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

77

Present and Future of Fault Tolerant Drives Applied to Transport Applications

Autoren:
Deng, Xu; Wu, Haimeng; Gu, Bowen; Atkinson, Glynn; Mecrow, Barrie; Pickert, Volker
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

78

Reduction of Common Mode EMI noise in microstrip line based commutation paths designed for sub-nH loop inductance

Autoren:
Seliger, Norbert; Dechant, Eduard; Brendel, Christian; Kennel, Ralph
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

79

Reliability of Capacitors and Magnetic Components in Power Electronic Applications

Autoren:
Wang, Huai; Wang, Haoran; Shen, Zhan
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

80

SiC Power Module with integrated RC-Snubber Design for Voltage Overshoot and Power Loss Reduction

Autoren:
Rettner, Cornelius; Schiedermeier, Maximilian; Apelsmeier, Andreas; Heckel, Thomas; Diepgen, Antonia; Klische, Alexander; Dirksen, Daniel; Maerz, Martin
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems