1
Power module packaging comprising direct pressed substrate with su- perior thermal performance and reliability
Autoren:
Tauer, Matthias; Jappe, Tiago; Panyik, Tamas; Gyimothy, Zsolt; Buza, Mate
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
2
Presentation of a Reliable Molded Power-PrePackage
Autoren:
Thomas, Tina; Raemer, Olaf; Nguyen, Thanh Duy; Hoene, Eckart; Braun, Tanja; Liu, Chunlei; Pavlice, Niko
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
3
PWM power cycling of a multichip power module with active die tem- perature equalization
Autoren:
Brandelero, Julio
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
4
Qualifying a Silicon Carbide Power Module: Reliability Testing Beyond the Standards of Silicon Devices
Autoren:
Salmen, Paul; Friedrichs, Peter
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
5
Quantitative Assessment of the Porosity in Ag-sintered Joints by non-destructive acoustic Inspection supplemented with a Deep Leaning assisted Signal Analysis
Autoren:
Brand, Sebastian; Koegel, Michael; Altmann, Frank; Bach, Linh
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
6
Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation
Autoren:
Sprenger, Mario; Forndran, Freerik; Ottinger, Bettina; Braun, Tobias; Franke, Joerg
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
7
Reliability Enhancement of High-Power Semiconductor Modules with Insulated Metal Baseplate and Epoxy Encapsulation
Autoren:
Wang, Yangang; Morshed, Muhammad; Wei, Si; Grant, Thomas; Longley, Daniel; Li, Xiang; Chang, Guiqin; Liu, Guoyou
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
8
Reliability investigation of SiC MOSFETs under switching operation in various packages
Autoren:
Schwabe, Christian; Thoenelt, Nick; Basler, Thomas
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
9
Review of Electric Field Reduction Methods for Medium-Voltage Power Modules
Autoren:
Cairnie, Mark; DiMarino, Christina
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
10
Rugged and fast short circuit detection method for GaN HEMT based on saturation detection
Autoren:
Schmitz, Jan; Meissner, Markus; Bernet, Steffen
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
11
Self-healing encapsulation material for auto-repairable power module architectures
Autoren:
Arati, Baptiste; Bley, Vincent; Brandelero, Julio; Teyssedre, Gilbert
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
12
Self-turn-on-free criteria for MOS gate power device and circuit
Autoren:
Nishio, Takanao; Omura, Ichiro
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
13
SiC automotive power module with laser welded, ultra low inductive terminals and up to 900Arms phase current
Autoren:
Beckedahl, Peter; Bogen, Ingo; Steger, Juergen
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
14
Silver-free thick film copper bonding for highly reliable metal ceramic substrates
Autoren:
Schwoebel, Andre; Fabian, Benjamin; Schnee, Daniel; Rauer, Miriam; Miric, Anton; Gunst, Stefan
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
15
Stability Modeling for Multichip SiC MOSFET Power Modules
Autoren:
Shen, Yanfeng; Dong, Xiaoting; Schuetz, Tobias; Roesner, Robert
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
16
Sub-Nanosecond Transient Analysis of SiC MOSFET Switching: "Sensor Gap TLP" as a Versatile Characterization Method with Very High Temporal Resolution
Autoren:
Groos, Gerhard; Helmut, Dennis; Wachutka, Gerhard; Schrag, Gabriele
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
17
Substrate Bias Effects up to 400 V of Normally-On GaN-on-AlN/SiC HEMTs in Static and Dynamic Tests
Autoren:
Heucke, Soeren; Hilt, Oliver; Geng, Xiaomeng; Kuring, Carsten; Wuerfl, Joachim; Dieckerhoff, Sibylle
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
18
Substrate Integrated Temperature Sensing for Bondless Power Modules
Autoren:
Riefer, Manuel; Winkler, Jonathan; Strache, Sebastian; Kallfass, Ingmar
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
19
Temperature Compensated M-Shunts for Fast Transient and Low Inductive Current Measurements
Autoren:
Lutzen, Hauke; Polezhaev, Vladimir; Rawal, Keshar Bahadur; Ahmmed, Kayesar; Huesgen, Till; Kaminski, Nando
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
20
The Effect of Parallel-Connected Varistor on UIS Robustness of SiC MOSFETs for Solid-State Circuit Breakers Application
Autoren:
Lou, Zaiqi; Zhu, Yunjie; Nishizawa, Shin-ichi; Saito, Wataru
Konferenz:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems