Silver-free thick film copper bonding for highly reliable metal ceramic substrates

Konferenz: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
15.03.2022 - 17.03.2022 in Berlin, Germany

Tagungsband: ETG-Fb. 165: CIPS 2022

Seiten: 6Sprache: EnglischTyp: PDF

Autoren:
Schwoebel, Andre; Fabian, Benjamin; Schnee, Daniel; Rauer, Miriam; Miric, Anton; Gunst, Stefan (Heraeus Deutschland GmbH & Co. KG, Hanau, Germany)

Inhalt:
Heraeus Electronics’ silver-free Thick Film Copper Bonding (TFCB(r)) technology addresses the cost-performance gap between the active metal brazed (AMB) Si3N4 based metal ceramic substrates (MCS) suitable for high-end applications and the cost-efficient direct copper bonded (DCB) Al2O3 substrates suitable for applications with lower requirements. The cost reduction of the TFCB(r) process is achieved by using a silver-free brazing technology combined with an efficient brazing process. Within this report we will demonstrate the performance of our TFCB(r) substrates as a result of application related tests showing thermal-, isolation-partial discharge performance and robustness in thermal shock testing.