61
Poly-CMP integration for sub 90 nm self-aligned floating gate flash memories
Autoren:
Mariani, Marcello; Canevari, Luca; Romanelli, Claudia
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology
62
Post-CMP Clean PVA Brush Design Advancements and Characterization in Cu/Low-k Applications
Autoren:
Singh, Rakesh K.; Wargo, Christopher R.; Stockbower, David W.
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology
63
Post-CMP Cleaning: Interaction between Particles and Surfaces
Autoren:
Park, J.-G.; Kim, T.-G.
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology
64
Pre-polishing transient effects investigation for Chemical Mechanical Planarization processes
Autoren:
Filippini, Andrea; Patini, Cosimo
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology
65
Prime Wafer Geometry Improvement during Haze-free Polishing with Peter Wolters Polishing Head “M-Carrier”
Autoren:
Kanzow, J.; Langenkamp, M.; Mörsch, G.
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology
66
Reduction of Dishing in Polysilicon CMP for MEMS Application by Using protective Layer and High Selectivity
Autoren:
Shin, Woonki; Park, Sungmin; Kim, Hyoungjae; Park, Kihyun; Joo, Sukbae; Jeong, Haedo
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology
67
Study of STI CMP Process Control on High Aspect Ratio Gap-fill Topographies by Motor Current EPD
Autoren:
Kuo, Chi-Hsiang; Meyer, Frank C.; Hollatz, Mark; Faustmann, Peter; Chung, Kee-Wei; Lin, Ching-Kai
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology
68
Study on Material Removal Phenomena in CMP Process
Autoren:
Kimura, Keiichi; Hashiyama, Yuichi; Khajornrungruan, Panart; Hiyama, Hirokuni; Mochizuki, Yoshihiro
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology
69
TaN Cup Formation by CMP for Cross-Spacered Phase Change Memory
Autoren:
Lin, Ke-Chin; Chen, Chih-Wei; Wang, Shih-Hui; Shu, Dun-Ying; Kao, Ming-Jer; Tsai, Ming-Jinn
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology
70
The Fabrication of Ideal Diamond Disk (IDD) by Casting Diamond Film on Silicon wafer
Autoren:
Sung, James C.; Sung, James C.; Sung, James C.; Chen, Ying-Tung; Kan, Ming-Chi; Chang, Hsiao-Kuo; Sung, Michael
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology
71
The Organic Diamond Disk (ODD) for Dressing Polishing Pads of Chemical Mechanical Planarization
Autoren:
Sung, James C.; Sung, James C.; Sung, James C.; Chou, Cheng-Shiang; Pai, Yang-Liang; Sung, Michael
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology
72
The Study of CVD diamond conditioner
Autoren:
Rikita, Naoki; Matsuki, Ryuichi; Kobayashi, Hiroyuki; Nakamura, Masato; Chida, Kasumi
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology
73
Three-Dimensional Metrology for CMP process evaluation with In-line Wide-Area Atomic Force Microscope
Autoren:
Murayama, Ken; Morimoro, Takafumi; Kunitomo, Yuichi; Edamura, Manabu; Sekino, Satoshi; Kurenuma, Toru
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology
74
Tribological, Kinetic, Thermal and Flow Characteristics of PPS and PEEK Retaining Rings
Autoren:
Wei, X.; Philipossian, A.; Philipossian, A.; Sampurno, Y.; Sudargho, F.; Sudargho, F.; Zhuang, Y.; Zhuang, Y.; Wargo, C.; Borucki, L.
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology
75
Voltage-Activated Electrochemical Reactions of Copper for Electrochemical Mechanical Polishing (ECMP) Application
Autoren:
Seo, Yong-Jin; Park, Sung-Woo; Han, Sang-Jun; Lee, Young-Kyun; Lee, Woo-Sun
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology
76
Wafer edge / bevel treatment of device wafers by means of CMP
Autoren:
Wieters, Anngret; Thieme, Peter
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology