IEC TS 62647-2:2012
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
Ausgabedatum:
2012-11
Edition:
1.0
Sprache: EN - englisch
Seitenzahl: 68 VDE-Artnr.: 219417
IEC/TS 62647-2:2012(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes. It may be used by other high-performance and high-reliability industries, at their discretion.