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IEC TS 62647-4:2018

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling

280,00 € 

IEC TS 62647-3:2014

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes

280,00 € 

IEC TS 62647-23:2013

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies

280,00 € 

IEC TS 62647-22:2013

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines

365,00 € 

IEC TS 62647-21:2013

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics

249,99 € 

IEC TS 62647-2:2012

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin

365,00 € 

IEC TS 62647-1:2012

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan

249,99 €