IEC 60747-16-5:2013Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
280,00 €
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IEC TR 62258-4:2012Semiconductor die products - Part 4: Questionnaire for die users and suppliers
115,00 €
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IEC 62047-5:2011/COR1:2012Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
0,00 €
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IEC 62047-9:2011/COR1:2012Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
0,00 €
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IEC 62047-13:2012Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
80,00 €
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IEC 62047-14:2012Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
115,00 €
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IEC 62047-10:2011/COR1:2012Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
0,00 €
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IEC 62047-12:2011Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
200,00 €
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IEC 62047-10:2011Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
40,00 €
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IEC 62047-5:2011Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
249,99 €
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IEC 62047-9:2011Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
155,00 €
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IEC 62047-7:2011Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
200,00 €
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IEC 60747-16-4:2004+AMD1:2009 CSV (Consolidated Version)Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
375,00 €
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IEC 62047-8:2011Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
115,00 €
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IEC 62374-1:2010Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
80,00 €
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IEC TR 62258-3:2010Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
320,00 €
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IEC 60747-16-3:2002+AMD1:2009 CSV (Consolidated Version)Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
465,00 €
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IEC 60747-14-3:2009Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
115,00 €
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IEC 62047-6:2009Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
80,00 €
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