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IEC 62899-202-3:2019

Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method

70,00 € 

IEC 62899-201:2016/AMD1:2018

Amendment 1 - Printed electronics - Part 201: Materials - Substrates

70,00 € 

IEC 62899-202-5:2018

Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate

70,00 € 

IEC 62899-403-1:2018

Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine

145,00 € 

IEC 61189-2-630:2018

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning

20,00 € 

IEC 61249-2-47:2018

Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(mÌK) and defined flammability (vertical burning test), copper-clad for lead-free assembly

145,00 € 

IEC 61249-2-45:2018

Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(mÌK) and defined flammability (vertical burning test), copper-clad for lead-free assembly

145,00 € 

IEC 61249-2-46:2018

Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(mÌK) and defined flammability (vertical burning test), copper-clad for lead-free assembly

145,00 € 

IEC 60194-2:2017

Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

245,00 € 

IEC 61189-5-503:2017

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

145,00 € 

IEC 61188-7:2017

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

105,00 € 

IEC TR 61189-3-914:2017

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

145,00 € 

IEC 62899-401:2017

Printed electronics - Part 401: Printability - Overview

40,00 € 

IEC 62899-402-1:2017

Printed electronics - Part 402-1: Printability - Measurement of qualities - Pattern width

70,00 € 

IEC TR 62899-250:2016

Printed electronics - Part 250: Material technologies required in printed electronics for wearable smart devices

70,00 € 

IEC 63055:2016

Format for LSI-Package-Board Interoperable design

350,00 € 

IEC TS 61189-3-301:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB

70,00 € 

IEC 61189-2-719:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)

105,00 € 

IEC 61189-5-1:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

175,00 € 

IEC 61249-2-44:2016

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

145,00 €