IEC 61249-6-3:2023Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
155,00 €
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IEC TR 61191-9:2023Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices
365,00 €
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IEC 61249-2-51:2023Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
115,00 €
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IEC PAS 61191-10:2022Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
450,00 €
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IEC TR 62878-2-9:2022Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
80,00 €
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IEC 61189-2-501:2022Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
80,00 €
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IEC 62899-202-4:2021Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)
155,00 €
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IEC TR 62899-402-4:2021Printed electronics - Part 402-4: Printability - Measurement of qualities - Classification and measurement methods for morphology
115,00 €
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IEC 61189-2-807:2021Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
40,00 €
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IEC TR 62878-2-8:2021Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
80,00 €
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IEC 62878-2-602:2021Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
80,00 €
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IEC 62899-402-3:2021Printed electronics - Part 402-3: Printability - Measurement of qualities - Voids in printed pattern using a two-dimensional optical image
115,00 €
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IEC TR 61191-8:2021Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
249,99 €
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IEC 61189-5-301:2021Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
249,99 €
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IEC 61188-6-1:2021Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
249,99 €
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IEC 60194-1:2021Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
450,00 €
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IEC 61188-6-2:2021Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
155,00 €
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IEC 61189-5-502:2021Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies
155,00 €
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