Cover IEC 61188-6-1:2021

IEC 61188-6-1:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

Ausgabedatum: 2021-02
Edition: 1.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 63 VDE-Artnr.: 249690


IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.