IEC 62326-20:2016Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
270,00 €
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IEC 61189-3-719:2016Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
40,00 €
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IEC 61189-3-913:2016Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
190,00 €
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IEC TR 63018:2015Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials
80,00 €
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IEC TR 63017:2015Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations
80,00 €
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IEC 62878-1-1:2015Device embedded substrate - Part 1-1: Generic specification - Test methods
300,00 €
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IEC 61189-2-721:2015Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator
150,00 €
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IEC TS 62878-2-1:2015Device embedded substrate - Part 2-1: Guidelines - General description of technology
190,00 €
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IEC TS 62878-2-4:2015Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
235,00 €
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IEC 61189-5-2:2015Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
270,00 €
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IEC 61189-5-3:2015Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
235,00 €
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IEC 61189-5-4:2015Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
150,00 €
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IEC TR 62866:2014Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
375,00 €
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IEC 61249-4-18:2013Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
80,00 €
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IEC 61249-4-19:2013Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
80,00 €
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IEC 61189-11:2013Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
80,00 €
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IEC 61249-2-27:2012Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
150,00 €
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IEC 61249-2-30:2012Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
150,00 €
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