IEC 61189-5-503:2017Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
155,00 €
|
IEC 61188-7:2017Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
115,00 €
|
IEC TR 61189-3-914:2017Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
155,00 €
|
IEC TS 61189-3-301:2016Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB
80,00 €
|
IEC 61189-2-719:2016Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
115,00 €
|
IEC 61189-5-1:2016Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
200,00 €
|
IEC 61249-2-44:2016Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
155,00 €
|
IEC 61249-2-43:2016Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
155,00 €
|
IEC 62326-20:2016Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
280,00 €
|
IEC 61189-3-719:2016Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
40,00 €
|
IEC 61189-3-913:2016Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
200,00 €
|
IEC TR 63018:2015Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials
80,00 €
|
IEC TR 63017:2015Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations
80,00 €
|
|
IEC 62878-1-1:2015Device embedded substrate - Part 1-1: Generic specification - Test methods
320,00 €
|
IEC 61189-2-721:2015Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator
155,00 €
|
IEC TS 62878-2-1:2015Device embedded substrate - Part 2-1: Guidelines - General description of technology
200,00 €
|
|
IEC TS 62878-2-4:2015Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
249,99 €
|
IEC 61189-5-2:2015Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
280,00 €
|