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IEC 62878-2-5:2019

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

277,29 € 

IEC 61191-2:2017/COR1:2019

Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

0,00 € 

IEC 60068-2-69:2017+AMD1:2019 CSV (Consolidated Version)

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

410,80 € 

IEC 60068-2-69:2017/AMD1:2019

Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

20,54 € 

IEC TR 62878-2-7:2019

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

71,89 € 

IEC 61191-1:2018

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

246,48 € 

IEC 61191-1:2018 RLV

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

320,43 € 

IEC 61760-4:2015/AMD1:2018

Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

10,27 € 

IEC 61760-4:2015+AMD1:2018 CSV (Consolidated Version)

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

282,42 € 

IEC 60068-2-69:2017/COR1:2018

Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)

0,00 € 

IEC 60194-2:2017

Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

246,48 € 

IEC 61190-1-3:2017

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

246,48 € 

IEC 60068-2-58:2015/AMD1:2017

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

20,54 € 

IEC 60068-2-58:2015+AMD1:2017 CSV (Consolidated Version)

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

308,10 € 

IEC 61191-2:2017

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

205,41 € 

IEC 62090:2017

Product package labels for electronic components using bar code and two-dimensional symbologies

205,41 € 

IEC 60068-2-69:2017

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

277,29 € 

IEC 62739-3:2017

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

205,41 € 

IEC 62739-2:2016

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing

71,89 € 

IEC TR 62878-2-2:2015

Device embedded substrate - Part 2-2: Guidelines - Electrical testing

71,89 €