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IEC 61760-3:2021

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

175,00 € 

IEC 61191-2:2017/COR1:2019

Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

0,00 € 

IEC 61191-1:2018

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

245,00 € 

IEC 61191-1:2018 RLV

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

319,00 € 

IEC 61760-4:2015/AMD1:2018

Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

10,00 € 

IEC 61760-4:2015+AMD1:2018 CSV (Consolidated Version)

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

280,00 € 

IEC 60068-2-69:2017/COR1:2018

Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)

0,00 € 

IEC 61190-1-3:2017

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

245,00 € 

IEC 60068-2-58:2015+AMD1:2017 CSV (Consolidated Version)

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

300,00 € 

IEC 61191-2:2017

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

205,00 € 

IEC 62090:2017

Product package labels for electronic components using bar code and two-dimensional symbologies

205,00 € 

IEC 62739-3:2017

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

205,00 € 

IEC 62739-2:2016

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing

70,00 € 

IEC 61760-4:2015

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

205,00 € 

IEC 62137-4:2014

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

245,00 € 

IEC 61190-1-2:2014

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

145,00 € 

IEC 62739-1:2013

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

105,00 € 

IEC 61193-3:2013

Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

310,00 € 

IEC 60068-2-21:2006/COR1:2012

Corrigendum 1 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

0,00 € 

IEC 62137-3:2011

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

245,00 €