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IEC TR 61191-7:2020

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

316,35 € 

IEC 62878-1:2019

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

100,65 € 

IEC 61191-2:2017/COR1:2019

Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

0,00 € 

IEC 62878-2-5:2019

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

268,41 € 

IEC 60068-2-69:2017+AMD1:2019 CSV (Consolidated Version)

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

383,45 € 

IEC 60068-2-69:2017/AMD1:2019

Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

19,17 € 

IEC TR 62878-2-7:2019

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

67,10 € 

IEC 61191-1:2018

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

234,85 € 

IEC 61191-1:2018 RLV

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

305,80 € 

IEC 61760-4:2015/AMD1:2018

Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

9,59 € 

IEC 61760-4:2015+AMD1:2018 CSV (Consolidated Version)

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

268,41 € 

IEC 60068-2-69:2017/COR1:2018

Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)

0,00 € 

IEC 60194-2:2017

Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

234,85 € 

IEC 61190-1-3:2017

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

234,85 € 

IEC 60068-2-58:2015/AMD1:2017

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

19,17 € 

IEC 60068-2-58:2015+AMD1:2017 CSV (Consolidated Version)

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

287,58 € 

IEC 61191-2:2017

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

196,52 € 

IEC 62090:2017

Product package labels for electronic components using bar code and two-dimensional symbologies

196,52 € 

IEC 60068-2-69:2017

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

268,41 € 

IEC 62739-3:2017

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

196,52 €