IEC TR 61760-5-1:2024Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
150,00 €
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IEC 63215-2:2023Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices
150,00 €
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IEC TR 61760-3-1:2022Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
190,00 €
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IEC 61760-3:2021Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
190,00 €
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IEC 61191-2:2017/COR1:2019Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
0,00 €
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IEC 61191-1:2018Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
270,00 €
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IEC 61191-1:2018 RLVPrinted board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
351,00 €
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IEC 61760-4:2015/AMD1:2018Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
10,00 €
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IEC 61760-4:2015+AMD1:2018 CSV (Consolidated Version)Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
335,00 €
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IEC 61190-1-3:2017Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
270,00 €
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IEC 61191-2:2017Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
235,00 €
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IEC 62090:2017Product package labels for electronic components using bar code and two-dimensional symbologies
235,00 €
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IEC 62739-3:2017Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
235,00 €
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IEC 62739-2:2016Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
80,00 €
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IEC 61760-4:2015Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
235,00 €
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IEC 62137-4:2014Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
270,00 €
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IEC 61190-1-2:2014Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
150,00 €
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IEC 62739-1:2013Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
115,00 €
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IEC 61193-3:2013Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
345,00 €
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IEC 62137-3:2011Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
270,00 €
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