IEC 62137-1-5:2009

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

IEC 62137-1-4:2009

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

IEC 62137-1-3:2008

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

IEC 61193-2:2007

Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages

IEC 62421:2007

Electronics assembly technology - Electronic modules

IEC 62137-1-2:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

IEC 62137-1-1:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

IEC 61188-5-6:2003

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

IEC 61190-1-1:2002

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

IEC 61193-1:2001

Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies