IEC 61188-5-6:2003
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
Ausgabedatum:
2003-01
Edition:
1.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 37 VDE-Artnr.: 210415
Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.