IEC 61636-2:2023

Software Interface for Maintenance Information Collection and Analysis (SIMICA) - Part 2: Exchanging Maintenance Action Information via the Extensible Markup Language (XML)

IEC TR 60068-3-12:2022

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile

IEC PAS 61191-10:2022

Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies

IEC TR 61760-3-1:2022

Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method

IEC TR 62878-2-9:2022

Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries

IEC 61189-2-501:2022

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T_d) using TGA

IEC 62530:2021

SystemVerilog - Unified Hardware Design, Specification, and Verification Language

IEC 62530-2:2021

SystemVerilog - Part 2: Universal Verification Methodology Language Reference Manual

IEC 61691-8:2021

Behavioural languages - Part 8: Standard SystemC Analog/Mixed-Signal Extensions Language Reference Manual

IEC 61760-2:2021

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

IEC 61760-2:2021 RLV

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

IEC 60068-2-21:2021

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

IEC TR 62878-2-8:2021

Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate

IEC 62878-2-602:2021

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

IEC 61636:2021

Software Interface for Maintenance Information Collection and Analysis (SIMICA)

IEC 61636-1:2021

Software Interface for Maintenance Information Collection and Analysis (SIMICA): Exchanging Test Results and Session Information via the eXtensible Markup Language (XML)

IEC 61691-6:2021

Behavioural languages - Part 6: VHDL Analog and Mixed-Signal Extensions

IEC 60068-2-20:2021 RLV

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

IEC 60068-2-20:2021

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads