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IEC 61760-2:2021

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

70,00 € 

IEC 61760-2:2021 RLV

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

91,00 € 

IEC 60068-2-21:2021

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

245,00 € 

IEC TR 62878-2-8:2021

Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate

70,00 € 

IEC 62878-2-602:2021

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

70,00 € 

IEC 61636:2021

Software Interface for Maintenance Information Collection and Analysis (SIMICA)

245,00 € 

IEC 61636-1:2021

Software Interface for Maintenance Information Collection and Analysis (SIMICA): Exchanging Test Results and Session Information via the eXtensible Markup Language (XML)

205,00 € 

IEC 61691-6:2021

Behavioural languages - Part 6: VHDL Analog and Mixed-Signal Extensions

350,00 € 

IEC 60068-2-20:2021 RLV

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

189,00 € 

IEC 60068-2-20:2021

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

105,00 € 

IEC TR 61191-8:2021

Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices

205,00 € 

IEC 61189-5-301:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

205,00 € 

IEC 61188-6-1:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

205,00 € 

IEC 60194-1:2021

Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

350,00 € 

IEC 61188-6-2:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

145,00 € 

IEC 61189-5-502:2021

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies

145,00 € 

IEC 61189-5-601:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

205,00 € 

IEC 61760-3:2021

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

175,00 € 

IEC 61189-5-501:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

105,00 € 

IEC TR 61188-8:2021

Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library

105,00 €