IEC 62878-2-603:2025Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
80,00 €
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IEC 60194-2:2025Electronic assembly, design and circuit boards - Vocabulary - Part 2: Common usage in electronic technologies as well as electronic assembly technologies
280,00 €
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IEC 61188-6-3:2024Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
249,99 €
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IEC 61189-2-809:2024Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA
40,00 €
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IEC TR 60068-3-82:2024Environmental testing - Part 3-82: Supporting documentation and guidance - Confirmation of the performance of whisker test method
320,00 €
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IEC 61189-2-808:2024Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
115,00 €
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IEC 61189-2-805:2024Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA
40,00 €
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IEC 61189-2-720:2024Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
40,00 €
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IEC 61523-4:2023/COR1:2024Corrigendum 1 - Delay and power calculation standards - Part 4: Design and Verification of Low-Power, Energy-Aware Electronic Systems
0,00 €
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IEC TR 60068-3-15:2024Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering
200,00 €
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IEC TR 61760-5-1:2024Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
155,00 €
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IEC TS 62878-2-10:2024Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
40,00 €
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IEC 63251:2023Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
155,00 €
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IEC 63215-2:2023Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices
155,00 €
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IEC 61523-1:2023Delay and power calculation standards - Part 1: Integrated Circuit (IC) Open Library Architecture (OLA)
450,00 €
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IEC 61523-4:2023Delay and power calculation standards - Part 4: Design and Verification of Low-Power, Energy-Aware Electronic Systems
450,00 €
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