IEC 61189-3-302:2025
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
Ausgabedatum:
2025-10
Edition:
1.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 34 VDE-Artnr.: 255549
IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).
This document is applicable to non-destructive testing of metallized holes.