IEC 61189-1:1997+AMD1:2001 CSV (Consolidated Version)

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

IEC 61189-1:1997/AMD1:2001

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

IEC 61690-1:2000

Electronic design interchange format (EDIF) - Part 1: Version 3 0 0. (This publication is available in electronic HTML format only)

IEC 61690-2:2000

Electronic design interchange format (EDIF) - Part 2: Version 4 0 0. (This publication is available in electronic HTML format only)

IEC 61926-1:1999

Design automation - Part 1: Standard test language for all systems - Common abbreviated test language for all systems (C/ATLAS)

IEC 61249-2-13:1999

Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad

IEC 61249-3-4:1999

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film

IEC 61249-3-3:1999

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film

IEC 61249-3-5:1999

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

IEC 61249-2-12:1999

Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad

IEC 60068-2-77:1999

Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock

IEC 61249-8-8:1997

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

IEC 61189-1:1997

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

IEC 62326-4:1996

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

IEC 62326-4-1:1996

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C

IEC 61249-5-4:1996

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks

IEC 61249-8-7:1996

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks

IEC 61249-5-1:1995

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

IEC 61249-7-1:1995

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper