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IEC 61523-1:2023Delay and power calculation standards - Part 1: Integrated Circuit (IC) Open Library Architecture (OLA)
450,00 €
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IEC 61523-4:2023Delay and power calculation standards - Part 4: Design and Verification of Low-Power, Energy-Aware Electronic Systems
450,00 €
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IEC 62530-2:2023SystemVerilog - Part 2: Universal Verification Methodology Language Reference Manual
450,00 €
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IEC 61189-2-804:2023Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
20,00 €
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IEC 61189-2-801:2023Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
40,00 €
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IEC 61189-2-803:2023Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
20,00 €
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IEC 61249-6-3:2023Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
155,00 €
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IEC TR 61191-9:2023Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices
365,00 €
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IEC 61249-2-51:2023Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
115,00 €
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IEC 61636-2:2023Software Interface for Maintenance Information Collection and Analysis (SIMICA) - Part 2: Exchanging Maintenance Action Information via the Extensible Markup Language (XML)
155,00 €
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IEC TR 60068-3-12:2022Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
249,99 €
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IEC PAS 61191-10:2022Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
450,00 €
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IEC TR 61760-3-1:2022Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
200,00 €
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IEC TR 62878-2-9:2022Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
80,00 €
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IEC 61189-2-501:2022Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
80,00 €
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IEC 61189-2-807:2021Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
40,00 €
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