IEC 63055:2023
Format for LSI-Package-Board Interoperable design
Ausgabedatum:
2023-10
Edition:
2.0
Sprache: EN - englisch
Seitenzahl: 292 VDE-Artnr.: 252188
IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.