IEC 61189-5-2:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

IEC 61189-5-3:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

IEC 61189-5-4:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

IEC TR 62699-1:2014

Mapping rules and exchange methods for heterogeneous electronic parts libraries - Part 1: Building an integrated search system

IEC TR 60068-3-12:2014

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile

IEC 62137-4:2014

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

IEC PAS 61182-12:2014

Generic requirements for printed board assembly products manufacturing description data and transfer methodology

IEC PAS 61249-8-1:2014

Qualification and performance of electrical insulating compound for printed wiring assemblies

IEC PAS 61249-8-5:2014

Qualification and performance specification of permanent solder mask and flexible cover materials

IEC TR 62866:2014

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

IEC 61190-1-2:2014

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

IEC 61249-4-18:2013

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

IEC 61249-4-19:2013

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

IEC TR 62856:2013

Documentation on design automation subjects - The Bird's-eye View of Design Languages (BVDL)

IEC 62739-1:2013

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

IEC 61189-11:2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

IEC 61193-3:2013

Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

IEC 61249-2-27:2012

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad

IEC 61249-2-30:2012

Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad

IEC 61249-2-39:2012

Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly