IEC 61249-2-47:2018Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
155,00 €
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IEC 61249-2-45:2018Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
155,00 €
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IEC 61249-2-46:2018Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
155,00 €
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IEC 61190-1-3:2017Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
280,00 €
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IEC 60068-2-58:2015/AMD1:2017Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
20,00 €
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IEC 60068-2-58:2015+AMD1:2017 CSV (Consolidated Version)Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
465,00 €
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IEC 61191-4:2017Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
115,00 €
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IEC 61191-3:2017Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
115,00 €
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IEC 61191-2:2017Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
249,99 €
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IEC 61189-5-503:2017Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
155,00 €
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IEC 62090:2017Product package labels for electronic components using bar code and two-dimensional symbologies
249,99 €
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IEC 61188-7:2017Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
115,00 €
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IEC TR 61189-3-914:2017Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
155,00 €
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IEC 60068-2-69:2017Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
320,00 €
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IEC TR 63051:2017Documentation on design automation subjects - Mathematical algorithm hardware description languages for system level modeling and verification (HDLMath)
80,00 €
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IEC 62739-3:2017Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
249,99 €
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IEC TS 61189-3-301:2016Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB
80,00 €
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IEC 62739-2:2016Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
80,00 €
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IEC 61189-2-719:2016Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
115,00 €
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IEC 61189-5-1:2016Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
200,00 €
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