IEC 60749-7:2025Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
80,00 €
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IEC 60749-24:2025 RLVSemiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
68,00 €
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IEC 60749-24:2025Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
40,00 €
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IEC 60749-22-1:2025Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods
365,00 €
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IEC 60749-22-2:2025Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods
249,99 €
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IEC 60749-34-1:2025Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
200,00 €
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IEC 60749-5:2023Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
40,00 €
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IEC 60749-5:2023 RLVSemiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
68,00 €
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IEC 60749-37:2022Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
155,00 €
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IEC 60749-37:2022 RLVSemiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
264,00 €
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IEC 60749-10:2022Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
80,00 €
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IEC 60749-28:2022Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
280,00 €
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IEC 60749-28:2022 RLVSemiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
476,00 €
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IEC 60749-39:2021Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
80,00 €
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IEC 60749-39:2021 RLVSemiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
136,00 €
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IEC 60749-20:2020Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
200,00 €
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IEC 60749-20:2020 RLVSemiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
340,00 €
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IEC 60749-30:2020Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
80,00 €
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IEC 60749-30:2020 RLVSemiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
136,00 €
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IEC 60749-41:2020Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices
155,00 €
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