IEC 60749-5:2023Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
40,00 €
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IEC 60749-5:2023 RLVSemiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
52,00 €
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IEC 60749-37:2022Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
150,00 €
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IEC 60749-37:2022 RLVSemiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
195,00 €
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IEC 60749-10:2022Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
80,00 €
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IEC 60749-28:2022Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
270,00 €
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IEC 60749-28:2022 RLVSemiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
351,00 €
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IEC 60749-39:2021Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
80,00 €
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IEC 60749-39:2021 RLVSemiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
104,00 €
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IEC 60749-20:2020Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
190,00 €
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IEC 60749-20:2020 RLVSemiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
247,00 €
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IEC 60749-30:2020Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
80,00 €
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IEC 60749-30:2020 RLVSemiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
104,00 €
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IEC 60749-41:2020Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices
150,00 €
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IEC 60749-15:2020 RLVSemiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
52,00 €
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IEC 60749-15:2020Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
40,00 €
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IEC 60749-20-1:2019 RLVSemiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
351,00 €
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IEC 60749-20-1:2019Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
270,00 €
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IEC 60749-18:2019 RLVSemiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
195,00 €
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IEC 60749-18:2019Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
150,00 €
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