IEC TR 61191-9:2023Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices 
                365,00 € 
               
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    IEC PAS 61191-10:2022Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies 
                450,00 € 
               
               | 
    IEC TR 61191-8:2021Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices 
                249,99 € 
               
               | 
    IEC TR 61191-7:2020Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies 
                385,00 € 
               
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    IEC 61191-2:2017/COR1:2019Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies 
                0,00 € 
               
               | 
    IEC 61191-1:2018Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies 
                280,00 € 
               
               | 
    IEC 61191-1:2018 RLVPrinted board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies 
                476,00 € 
               
               | 
    IEC 61191-4:2017Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies 
                115,00 € 
               
               | 
    IEC 61191-3:2017Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies 
                115,00 € 
               
               | 
    IEC 61191-2:2017Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies 
                249,99 € 
               
               | 
    IEC 61191-6:2010Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method 
                249,99 € 
               
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