IEC 62878-2-603:2025Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
80,00 €
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IEC TS 62878-2-10:2024Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
40,00 €
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IEC TR 62878-2-9:2022Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
80,00 €
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IEC TR 62878-2-8:2021Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
80,00 €
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IEC 62878-2-602:2021Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
80,00 €
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IEC 62878-1:2019Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
115,00 €
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IEC 62878-2-5:2019Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
320,00 €
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IEC TR 62878-2-7:2019Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
80,00 €
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IEC 62878-1-1:2015Device embedded substrate - Part 1-1: Generic specification - Test methods
320,00 €
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IEC TS 62878-2-1:2015Device embedded substrate - Part 2-1: Guidelines - General description of technology
200,00 €
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IEC TS 62878-2-4:2015Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
249,99 €
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