IEC TR 62878-2-7:2019
Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
Ausgabedatum:
2019-03
Edition:
1.0
Sprache: EN - englisch
Seitenzahl: 12 VDE-Artnr.: 247268
IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.