IEC 60749-19:2003/AMD1:2010

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

IEC 60749-32:2002/AMD1:2010

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

IEC 60749-38:2008

Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory

IEC 60749-35:2006

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

IEC 60749-27:2006

Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)

IEC 60749-33:2004

Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave

IEC 60749-24:2004

Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST

IEC 60749-23:2004

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

IEC 60749-11:2002/COR2:2003

Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

IEC 60749-22:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

IEC 60749-31:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)

IEC 60749-32:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

IEC 60749-1:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General

IEC 60749-2:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure

IEC 60749-8:2002/COR2:2003

Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

IEC 60749-14:2003

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

IEC 60749-25:2003

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

IEC 60749-8:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

IEC 60749-36:2003

Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state

IEC 60749-19:2003

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength