Power embedding

Konferenz: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
15.03.2022 - 17.03.2022 in Berlin, Germany

Tagungsband: ETG-Fb. 165: CIPS 2022

Seiten: 7Sprache: EnglischTyp: PDF

Autoren:
Gottwald, Thomas; Martina, M. (Schweizer Electronic AG, Schweiz)
Marczok, C. (Fraunhofer IZM, Berlin, Germany)
Laumen, M. (ISEA RWTH Aachen University, Aachen, Germany)
Flieger, B.; Wendt, O. (TLK Thermo GmbH, Braunschweig, Germany)

Inhalt:
Embedding of power electronic components was a subject of several research activities and publicly funded projects. Many challenges had to be overcome to make the embedding approach a reality. Aspects of the technology, the supply chain and commercial aspects had to be considered to find the sweet spot and the right applications. The trend towards electrification of automotive applications and the pressure to reduce CO2 emissions was a key element for the adoption of power electronics embedding, which went into mass production this year. In the coming product generations, the crucial factor will be increased efficiency and increased power density. Wide bandgap semiconductors and embedding technologies are the ideal combination to achieve both targets.