Power Engineering Society in the VDE (VDE ETG) (Hrsg.)

ETG-Fb. 165: CIPS 2022

12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany

ETG-Fachberichte

2022, 516 Seiten, 140 x 124 mm, Slimlinebox, CD-Rom
ISBN 978-3-8007-5757-2, E-Book: ISBN 978-3-8007-5758-9
Persönliche VDE-Mitglieder erhalten auf diesen Titel 10% Rabatt

Inhaltsverzeichnis Vorwort

In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and high reliability. Monolithic and hybrid system integration will include advanced device concepts including wide bandgap devices, new packaging technologies and the overall integration of actuators/drives (mechatronic integration).

CIPS is consequently focused on the following main aspects:
- assembly and interconnect technology for power electronic devices and converters
- integration of hybrid systems and mechatronic systems with high power density
- systems‘ and components‘ operational behavior and reliability

Basic technologies for integrated power electronic systems as well as upcoming new important applications will be presented in interdisciplinary invited papers.

In 2022 the successful story of CIPS will continue as the conference focus is today more important than ever – increasing functionality, energy efficiency and system reliability while decreasing cost.
Die Energietechnische Gesellschaft im VDE (VDE ETG) bündelt im VDE mit über 12.000 Mitgliedern die Fachkompetenz der Energietechnik von der Erzeugung, Übertragung, Verteilung bis hin zu den vielfältigen Anwendungsfeldern.
Das umfangreiche Expertenwissen der ca. 300 ehrenamtlichen Mitarbeiter aus Industrie, For-schung, Versorgungsunternehmen, Hochschulen und Behörden, die in Fachbereichen, Fachaus-schüssen und Arbeitskreisen mitwirken, bildet die technisch-wissenschaftliche Basis für ETG-Veranstaltungen und -Publikationen.

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2

Artificial Intelligence and Long-term Performance of Power Electronics Systems

Autoren: Zhao, Shuai; Peyghami, Saeed; Gebbran, Daniel; Dragicevic, Tomislav; Wang, Huai; Blaabjerg, Frede

3

Power embedding

Autoren: Gottwald, Thomas; Martina, M.; Marczok, C.; Laumen, M.; Flieger, B.; Wendt, O.

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5

Power module packaging comprising direct pressed substrate with su- perior thermal performance and reliability

Autoren: Tauer, Matthias; Jappe, Tiago; Panyik, Tamas; Gyimothy, Zsolt; Buza, Mate

6

7

8

Advanced cooling concept based on standard power modules significantly improves lifetime

Autoren: Buschhorn, Stefan; Mainka, Krzysztof; Vogel, Klaus

9

Pareto front system optimization on the example of a motor drive

Autoren: Hoffmann, Stefan; Hoene, Eckart

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12

GaN-HEMT Based Test Setup for Measurement of Core Losses Under DC-Bias

Autoren: Kohlhepp, Benedikt; Kuebrich, Daniel; Duerbaum, Thomas

13

3-D Electrothermal Modeling of SiC Multichip Power Modules for a More Accurate Reliability Assessment

Autoren: Race, Salvatore; Stark, Roger; Kovacevic-Badstuebner, Ivana; Nagel, Michel; Ziemann, Thomas; Tsibizov, Alexander; Grossner, Ulrike

14

Substrate Bias Effects up to 400 V of Normally-On GaN-on-AlN/SiC HEMTs in Static and Dynamic Tests

Autoren: Heucke, Soeren; Hilt, Oliver; Geng, Xiaomeng; Kuring, Carsten; Wuerfl, Joachim; Dieckerhoff, Sibylle

15

Design and Optimization of the Driver Circuit for Non-Insulating Gate GaN-Transistors Enabling Fast Switching and High-Frequency Operation

Autoren: Geng, Xiaomeng; Kuring, Carsten; Hilt, Oliver; Wolf, Mihaela; Wuerfl, Joachim; Dieckerhoff, Sibylle

16

17

Accelerated Lifetime Testing and Failure Analysis for Advanced Automotive Grade Ceramic Capacitors (MLCC)

Autoren: Dresel, Fabian; Leib, Juergen; Schletz, Andreas; Boettge, Bianca; Klengel, Sandy

18

Aging of Insulation Materials under Repetitive Impulse Voltage Stress with high dv/dt

Autoren: Claudi, Albert; Braun, Gerrit; Klengel, Robert; Klengel, Sandy; Zacharias, Peter; Yu, Xiao

19

In-situ Detection of Degradation in Power Electronic Modules During Lifetime Testing using Lock-in Thermography

Autoren: Schiffmacher, Alexander; Malasani, Shreyas; Prescher, Mario; Kirste, Lutz; Wilde, Juergen

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21

Silver-free thick film copper bonding for highly reliable metal ceramic substrates

Autoren: Schwoebel, Andre; Fabian, Benjamin; Schnee, Daniel; Rauer, Miriam; Miric, Anton; Gunst, Stefan

22

23

Self-healing encapsulation material for auto-repairable power module architectures

Autoren: Arati, Baptiste; Bley, Vincent; Brandelero, Julio; Teyssedre, Gilbert

24

Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding

Autoren: Hagedorn, Oliver; Broll, Marian; Kirsch, Olaf; Hemsel, Tobias; Sextro, Walter

25

Design and Evaluation of a Building Block for a 100kW DC/DC Converter Based on PCB Process

Autoren: Morand, Julien; Perrin, Remi; Le Lesle, Johan; Lefevre, Guillaume

26

Condition monitoring and evaluation of Ron degradation during power cycling in switching mode of SiC-Mosfets power modules

Autoren: Ibrahim, Ali; Lallemand, Richard; Khatir, Zoubir; Berkani, Mounira; Ingrosso, Damien

27

The limited usability of a ZTC-point in tracking IGBT degradation

Autoren: Schlottig, Gerd; Firla, Marcin; Goncalves de Medeiros, Helton; Halonen, Arttu; Ingman, Jonny; Vulli, Aleksi; Mengotti, Elena; Bianda, Enea

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29

Power Cycling Lifetime of Shunt Resistors in IGBT Modules

Autoren: Schmidt, Ralf; Kaesbauer, Michael; Endres, Michael; Sippel, Marcel; Botazzoli, Pietro

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31

Packaged β-Ga2O3 Schottky Diodes with Reduced Thermal Resistance by Substrate Thinning to 200μm

Autoren: Wilhelmi, Florian; Komatsu, Yuji; Yamaguchi, Shinya; Uchida, Yuki; Nemoto, Ryoichi; Lindemann, Andreas

32

Improved Thermal Impedance Measurement for Power Modules based on Thermal Imaging of the Baseplate

Autoren: Sippel, Marcel; Schmidt, Ralf; Rau, Fabian; Bretscher, Daniel; Seidel, Reinhardt; Franke, Joerg

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34

Development of an over temperature detection method via internal and emulated gate resistance

Autoren: Kawahara, Chihiro; Izuo, Shin-ichi; Brandelero, Julio; Degrenne, Nicolas

35

Presentation of a Reliable Molded Power-PrePackage

Autoren: Thomas, Tina; Raemer, Olaf; Nguyen, Thanh Duy; Hoene, Eckart; Braun, Tanja; Liu, Chunlei; Pavlice, Niko

36

Feedback Controlled IPM Inverter with Single PCB Rogowski Coil Sensor

Autoren: Bayarkhuu, Battuvshin; Bat-Ochir, Bat-Otgon; Omura, Ichiro

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Patterning and CTE-matching of contacts to optimize thermomechanical stress in power semiconductor pre-packages

Autoren: Pavlicek, Niko; Liu, Chunlei; Stalder, Patrick; Salvatore, Giovanni; Mohn, Fabian; Huesgen, Till; Thomas, Tina

39

An Integrated IGBT Module for Dual Inverter Applications

Autoren: Li, Jianfeng; Ma, Yaqing; Dong, Fangfang; Du, Yuekang; Arcillas, Joseph Castillo; Yan, Jiayi

40

41

Model reduction for sensitivity analysis of solder joint fracture in power electronic modules

Autoren: Schuler, Louis; Khatir, Zoubir; Berkani, Mounira; Ouhab, Merouane; Degrenne, Nicolas

42

Development of High Reliability Power SiC Module Platform Packag-ing for Low Carbon Vehicles

Autoren: Wang, Yangang; Harris, Anne; Liu, Guoyou; Li, Xiang; Morshed, Muhammad

43

Reliability Enhancement of High-Power Semiconductor Modules with Insulated Metal Baseplate and Epoxy Encapsulation

Autoren: Wang, Yangang; Morshed, Muhammad; Wei, Si; Grant, Thomas; Longley, Daniel; Li, Xiang; Chang, Guiqin; Liu, Guoyou

44

Stability Modeling for Multichip SiC MOSFET Power Modules

Autoren: Shen, Yanfeng; Dong, Xiaoting; Schuetz, Tobias; Roesner, Robert

45

Self-turn-on-free criteria for MOS gate power device and circuit

Autoren: Nishio, Takanao; Omura, Ichiro

46

PCB-Embedded Packaging for Ultra-Fast Switching of SiC MOSFETs

Autoren: Risch, Raffael; Biela, Juergen

47

Automatic Model Generation for PCB-based Power Electronics

Autoren: Ben Hamed, Bahaeddine; Regnat, Guillaume; Lefevre, Guillaume; Buttay, Cyril

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A gate driver for on-line heat-treatment to extend the lifetime of multichip power modules

Autoren: Quemener, Vincent; Le Lesle, Johan; Pichon, Pierre-Yves; Brandelero, Julio Cezar; Degrenne, Nicolas

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51

Use of a SPICE-based Transfer Function to Model the Absolute Humidity in a Power Semiconductor Module

Autoren: Quittard, Olivier; Ceccarelli, Edoardo; Gloor, Thomas; Paques, Gontran

52

Comparison of Different Methods for the Characterization of Online Junction Temperature of a Gallium-Nitride Power Transistor

Autoren: Sharmaa, Kanuj; Hueckelheim, Jan; Munoz Baron, Kevin; Ruthardt, Johannes; Kallfass, Ingmar

53

Rugged and fast short circuit detection method for GaN HEMT based on saturation detection

Autoren: Schmitz, Jan; Meissner, Markus; Bernet, Steffen

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55

Inverter Integration Strategy for a Modern Compact Motor Drive based on SiC

Autoren: Goerdes, Jan Philipp; Schnack, Jasper; Stolley, Jan; Schuemann, Ulf; Eisele, Ronald

56

Algorithmic Optimisation of Chip Dimensions and Layout Pattern in Press-Pack IGBT Devices

Autoren: Simpson, Robin; Wang, Yangang; Nicholson, Michael; Bell, Daniel

57

Characterization of a 25V GaN d-HEMT Device through Large Signal Gate Charge Measurements and In-Converter Testing

Autoren: O’Sullivan, Brendan; Fiebig, Norbert; Benkhelifa, Fouad; McCloskey, Paul; O’Mathuna, Cian; O’Driscoll, Seamus

58

High-Voltage, Low ESR Solid Electrolyte E-Caps for Automotive applications

Autoren: Buhrkal-Donau, Steffen; Gruia, Mihaela; Ebel, Thomas

59

Thermal Performance of an Integrated Heat Spreader for GaN HEMT devices

Autoren: Ahmad, Faheem; Aunsborg, Thore Stig; Beczkowski, Szymon Michal; Munk-Nielsen, Stig; Jorgensen, Asger Bjorn

60

Cooling Concept and Molding Packaging for PV Module Integrated Micro-Inverters

Autoren: Manthey, Tobias; Ranft, Paul; Friebe, Jens

61

Evaluation of the thermal contact resistance between bulk copper and metal foam using transient measurements

Autoren: Janod, Goulven; Avenas, Yvan; Bouvard, Didier; Khazaka, Rabih

62

Laser welding of copper terminals on ceramic substrates for power module packaging

Autoren: Dellert, Armin; Schirmer, Stefan; Kolb, Nadja; Kimmel, Michael; Goebl, Christian; Besendoerfer, Kurt Georg

63

An Embedded Power Section with GaN HEMTs

Autoren: Li, Tianyu; Voigt, Christian; Lindemann, Andreas; Erhardt, Eugen; Boettcher, Lars

64

Substrate Integrated Temperature Sensing for Bondless Power Modules

Autoren: Riefer, Manuel; Winkler, Jonathan; Strache, Sebastian; Kallfass, Ingmar

65

Reliability investigation of SiC MOSFETs under switching operation in various packages

Autoren: Schwabe, Christian; Thoenelt, Nick; Basler, Thomas

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67

An evaluation of Cu-to-Cu ultrasonic welding bond through thermal cycling

Autoren: De, Meghna; Agyakwa, Pearl A.; Arjmand, Elaheh; Mouawad, Bassem; Neate, Nigel; Steinhoff, Stefan; Johnson, C. Mark

68

Corrosion in Power Electronics

Autoren: Meier, Markus R.; Schweigart, Helmut

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AlON gate dielectric and gate trench cleaning for improved reliability of vertical GaN MOSFETs

Autoren: Goncalez Filho, Walter; Borga, Matteo; Geens, Karen; Cingu, Deepthi; Chatterjee, Urmimala; You, Shuzhen; Bakeroot, Benoit; Decoutere, Stefaan; Knaepen, Werner; Arnou, Panagiota; Homm, Pia

71

Large surface area substrate attach in power module applications

Autoren: Rabay, Battist; Stelzer, Adrian

72

Change in SiC MOSFET body-diode voltage drop in TO-247 packages during inverse-mode and forward-mode power cycling test

Autoren: Singh, Bhanu Pratap; Farjah, Amin; Chaudhury, Khaled Redwan; Norrga, Staffan; Nee, Hans-Peter

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Investigation of reliability issues in sintered silver interconnected power devices and its lifetime prediction by FEM and experiment

Autoren: Mathew, Anu; Dudek, Rainer; Otto, Alexander; Scherf, Christina; Rzepka, Sven; Subhaiah, Nilavzhagan; Arvind Rane, Kashmira; Wilde, Juergen

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GaN Reliability and Lifetime Projections

Autoren: Zhang, Shengke; Stecklein, Gordon; Garcia, Ricardo; Glaser, John; Tang, Zhikai; Strittmatter, Robert; Lidow, Alex

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Perspective on Condition and Health Monitoring of Power Electronic Converters

Autoren: Wang, Huai; Peng, Yingzhou; Wei, Xing

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EMI mitigation by substrate integrated common mode filter

Autoren: Seliger, Norbert; Dechant, Eduard; Kennel, Ralph

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Temperature Compensated M-Shunts for Fast Transient and Low Inductive Current Measurements

Autoren: Lutzen, Hauke; Polezhaev, Vladimir; Rawal, Keshar Bahadur; Ahmmed, Kayesar; Huesgen, Till; Kaminski, Nando

83

Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID)

Autoren: Borcherding, Holger; Springer, Andre; Mueller, Tobias; Ehlert, Patrick; Tolksdorf, Andreas

84

Performance Evaluation of a GaN Flying Capacitor Multilevel Inverter for Industrial Applications

Autoren: Hartwig, Raphael; Hensler, Alexander; Ellinger, Thomas