Model reduction for sensitivity analysis of solder joint fracture in power electronic modules

Konferenz: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
15.03.2022 - 17.03.2022 in Berlin, Germany

Tagungsband: ETG-Fb. 165: CIPS 2022

Seiten: 6Sprache: EnglischTyp: PDF

Autoren:
Schuler, Louis (Mitsubishi Electric R&D Centre Europe (MERCE), Rennes, France & Université Paris-Saclay, CentraleSupélec, ENS Paris-Saclay, CNRS, LMPS-Laboratoire de Mécanique Paris-Saclay, Gif-sur-Yvette, France)
Khatir, Zoubir (Université Gustave Eiffel, SATIE, Versailles, France)
Berkani, Mounira (Université Paris EST Créteil, SATIE, CNRS, ENS Paris-Saclay, Gif-sur-Yvette, France)
Ouhab, Merouane; Degrenne, Nicolas (Mitsubishi Electric R&D Centre Europe (MERCE), Rennes, France)

Inhalt:
This work develops an effective model reduction technique for parametrized thermo-mechanical problems encountered with power electronic modules. The model reduction relies on the Proper Generalized Decomposition (PGD) method. The method is first illustrated on a weakly coupled linear thermo-mechanical model, where a Basquin fatigue law models the lifetime. The PGD method is then applied to a nonlinear strongly coupled problem, with crack propagation in the solder joint. By increasing the module thermal resistance, the crack propagation affects both thermal and mechanical behaviors. The reduced-order model enables rapidly assessing the impact of design parameters on the module lifetime and is of paramount importance for multi-query context. The reduced-order model is illustrated through several numerical experiments.