Large surface area substrate attach in power module applications

Konferenz: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
15.03.2022 - 17.03.2022 in Berlin, Germany

Tagungsband: ETG-Fb. 165: CIPS 2022

Seiten: 4Sprache: EnglischTyp: PDF

Autoren:
Rabay, Battist; Stelzer, Adrian (Nano-Join GmbH, Berlin, Germany)

Inhalt:
Thermal management in power modules in automotive applications is gaining more attention due to the increasing power densities. Therefore, silver sintering is not only an option for first interface die attach, it is also a technology prospect for second interface substrate attach. In this work we present a silver sintering material which is capable of a low pressure sintering process to interconnect large substrates in one step on bare copper substrate.