Realization and Mounting of Additively Manufactured 3D Structures on Diced Microsystem Chips using Material Jetting
Konferenz: MikroSystemTechnik KONGRESS 2025 - Mikroelektronik/Mikrosystemtechnik und ihre Anwendungen – Nachhaltigkeit und Technologiesouveränität
27.10.2025-29.10.2025 in Duisburg, Germany
doi:10.30420/456614080
Tagungsband: MikroSystemTechnik Kongress 2025
Seiten: 5Sprache: EnglischTyp: PDF
Autoren:
Hauck, Lukas; Knechtel, Roy
Inhalt:
This work is about a method of placing and fixing additively manufactured polymer structures on integrated micro systems for prototyping purposes. It describes the realization of an exemplary structure made of UV-photopolymerizable material using the mSLA process, the defined forming of adhesive intermediate layers by material jetting as well as the positioning and mounting of the components using pick & place.