Improved visualization and understanding of complex microsystems through 3D-printed haptic models.

Inhalt:
System integration at both levels, system-on-chip and system-in-packaging [1], is now more than ever the key driver for increasing the functionality and performance of microsystems. In fact, it supports and extends Moore's Law [2] (doubling of integrated circuit performance every 1-2 years at minimal component cost) into the future. However, with this comes the fact that microsystems are becoming extremely complex and therefore very difficult to visualize, understand and explain. This is already true, to some extent, both for the engineers who design and manufacture such microsystems and for the customers who use them. On the other hand, it becomes extremely difficult to explain microsystems to pupils, students and interested adults. However, it is essential to address the shortage of skilled workers and engineers in the field of micro-technologies and to create a social understanding of the importance of these technologies. One way to overcome this, besides texts, images, animations and the use of 3D computer models, is the use of realistic, enlarged 3D printed models, which can show the structure, proportions and even the function of microsystems and can also be carriers of further information. This paper outlines some examples and is intended to demonstrate the potential of this approach.