Modeling and extraction of residual stresses in MEMS multilayer systems

Inhalt:
The intrinsic stresses introduced during the MEMS multilayer deposition process and the thermal stresses introduced during operation can significantly impact the performance, reliability, and lifetime of the product. The mechanical properties of the MEMS multilayer system are analyzed. An accurate closedform solution was obtained for the multilayer system, including both intrinsic stresses and thermal stresses, and validated by numerical FEM simulation. The intrinsic stresses were extracted from wafer bending measurements based on this modeling.