System-Technology-Co-Optimisation: The Heterogeneous Design Methodology in the APECS Pilot Line

Inhalt:
The chiplet era with advanced packaging calls for new heterogeneous design approaches. They must be able to combine different design domains across technological options while satisfying economic and performance demands from the application. It is crucial to ensure that the heterogeneous design meets the requirements with all relevant effects considered. Thus, a broad spectrum of information must be considered altogether. Such a holistic approach, however, has not yet been established to a significant extent. In the future, various chiplets and further components that are integrated into complex heterogeneous systems must be modelled, designed, simulated, analysed, and optimised in a comprehensive way and as simultaneously as possible. Among other topics, including quasi-monolithic integration (QMI), 2.5/3D integration, and characterization, test, and reliability (CTR), the APECS (Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems) pilot line will implement such an approach to cover a broad range from fundamental IC components, power management, compute units, and AI accelerators to various sensor implementations, and security features. Furthermore, different physical effects and couplings have to be addressed to meet a variety of analysis goals. This requires a new and extended design approach: the STCO design methodology (STCO: System-Technology-Co-Optimisation), which is to be established together with industry partners as part of the APECS Pilot Line with associated standardization activities. It will capture, aggregate, and connect requirements, data, rules etc. to enable the monitoring and control of economic, technological, and design implications stemming from the components, packages, and chiplets that altogether form complex heterogeneous systems for various target applications. Various dependencies and feedback effects between design and the implications from the selected manufacturing technologies, as well as the reliability and environmental aspects are included. The STCO design methodology will also support the necessary connectivity to the European design platform, as it will make "From Lab to Fab" easier and more accessible for European companies, especially fabless SMEs, and academic institutions.