Reducing Design-For-Manufacturing Complexity with Tool-Free Solder Preform Technology for Power Module Assembly

Konferenz: PCIM Asia 2021 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
09.09.2021 - 11.09.2021 in Shenzhen, China

Tagungsband: PCIM Asia 2021

Seiten: 5Sprache: EnglischTyp: PDF

Autoren:
Hertline, Joseph; Jensen, Timothy (Indium Corporation, USA)
Karch, Andreas (Indium Corporation, Germany)
Hutzler, Aaron (Bond Pulse, Germany)
Hu, Leo Yan Jie (Indium Corporation, China)

Inhalt:
Reliance on complex, costly alignment tooling is growing as power module designers seek improved solder reliability performance. A novel ad-hesive material technology, applied during assembly, eliminates the need for customized fixturing tools. This no-residue adhesive is demonstrated to achieve exceptional solderability without post-process cleaning steps. It is examined for compatibility with solder preforms and prevalent flux-free reflow techniques using formic acid, and empirical evidence confirms no residual impact. This results in less up-front design-for-manufacturing effort, reduced product introduction cycles, and lower capital investment, reducing the overall cost of owner-ship to achieve high quality solder performance for power module assembly.