New Generation 750V IGBT modules for automotive application
Konferenz: PCIM Asia 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
29.08.2023-31.08.2023 in Shanghai, China
doi:10.30420/566131044
Tagungsband: PCIM Asia 2023
Seiten: 6Sprache: EnglischTyp: PDF
Autoren:
Liu, Zhihong; Tang, Yi; Yan, Jinchun; Yong, Fu; Zheng, Songlin; Ma, Jiajie; Chen, Ye; Ling, Xi; Yao, Lijun (Starpower Semiconductors Ltd., China)
Inhalt:
In this paper, we introduce the new generation 750V Trench-IGBT module, which demonstrate significantly improved performance for automotive applications. This module uses the 750V IGBT chip with optimized trench cell configuration. The output capability can satisfy application requirements at different DC voltages and switching frequencies. In addition, the new diamond-shaped pin-fin baseplate is designed to improve the heat dissipation and temperature uniformity of the module.