Introduction of RC-IGBT Based Transfer Mold SOPIPM(TM)

Inhalt:
Mitsubishi Electric Corporation developed a new transfer mold Surface Mount Device (SMD) type Intelligent Power Module, SOPIPM(TM), for small capacity motor drive in home appliance products such as refrigerator, dishwasher, fans and so on. This paper presents its features, especially its compact size and its high reliability. By utilizing new packaging technology and thin wafer Reverse Conducting IGBT, RC-IGBT, SOPIPM(TM) successfully incorporates not only three-phase IGBT bridge and gate-driver ICs but also Bootstrap components like BSDs into a very compact surface mount type package. SOPIPM(TM) includes built-in protection features not only analog temperature signal output, over current, under voltage but also interlocking as an additional protection function. This module is manufactured by transfer mold technology which provides superior matching of thermal expansion coefficient. Due to this rich built-in components and protection functions with transfer mold technology, SOPIPM(TM) can realize dramatically small and simple inverter drive boards. As a result, this device greatly simplifies your design work and shortens your design time of the inverter power stage for home appliance products.