Optimization of Pinfin Heat Sink for SiC Power Module based on LBM-LES
Konferenz: PCIM Asia 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
29.08.2023-31.08.2023 in Shanghai, China
doi:10.30420/566131054
Tagungsband: PCIM Asia 2023
Seiten: 8Sprache: EnglischTyp: PDF
Autoren:
Cui, Jian (University of Chinese Academy of Sciences, Beijing, China % Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing, China & State Grid Shaoxing Electric Power Company，Ltd., China)
Ning, Puqi; Hui, Xiaoshuang (University of Chinese Academy of Sciences, Beijing, China % Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing, China)
Inhalt:
This paper uses the lattice Boltzmann method with turbulence model to simulate the thermal performance of power module with Pinfin heatsink. The simulated properties include inlet and outlet pressure drop and flow velocity around the cylinders of Pinfin. With the feature of fast simulation speed and easy coding, it is easy to be integrated into optimization algorithms. With the method, the selection of the diameter and spacing of the cylinders was optimized to improve the heat dissipation performance. The simulation results with CFD and experimental results verified the improvement of the heat dissipation performance.