Application benefits of TO-247 PLUS package reflow soldering in vehicle traction inverter

Inhalt:
External heat transfer of TO-247 PLUS package is determinative to extension of output current in inverter design. The application challenge with implementation of latest EDT2 chip is very prominent. Reflow soldering of such package is qualified to be efficient heat spread in combination with ceramic substrate. Backside of package lead frame can be soldered to DCB complying with soldering profile and MSL of JEDEC standard. Low RthjH from junction to heatsink is obviously beneficial to the rising of output current and elimination of thermal stress on lead frame. The power rating of traction inverter catering to the cost to performance requirement of A class EV car is designed with flexible number of discrete paralleling. The benchmark and comaprison of output current and junction temperature with different cooling approach have made by simulation results.