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61

Poly-CMP integration for sub 90 nm self-aligned floating gate flash memories

Authors:
Mariani, Marcello; Canevari, Luca; Romanelli, Claudia
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology

62

Post-CMP Clean PVA Brush Design Advancements and Characterization in Cu/Low-k Applications

Authors:
Singh, Rakesh K.; Wargo, Christopher R.; Stockbower, David W.
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology

63

Post-CMP Cleaning: Interaction between Particles and Surfaces

Authors:
Park, J.-G.; Kim, T.-G.
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology

64

Pre-polishing transient effects investigation for Chemical Mechanical Planarization processes

Authors:
Filippini, Andrea; Patini, Cosimo
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology

65

Prime Wafer Geometry Improvement during Haze-free Polishing with Peter Wolters Polishing Head “M-Carrier”

Authors:
Kanzow, J.; Langenkamp, M.; Mörsch, G.
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology

66

Reduction of Dishing in Polysilicon CMP for MEMS Application by Using protective Layer and High Selectivity

Authors:
Shin, Woonki; Park, Sungmin; Kim, Hyoungjae; Park, Kihyun; Joo, Sukbae; Jeong, Haedo
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology

67

Study of STI CMP Process Control on High Aspect Ratio Gap-fill Topographies by Motor Current EPD

Authors:
Kuo, Chi-Hsiang; Meyer, Frank C.; Hollatz, Mark; Faustmann, Peter; Chung, Kee-Wei; Lin, Ching-Kai
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology

68

Study on Material Removal Phenomena in CMP Process

Authors:
Kimura, Keiichi; Hashiyama, Yuichi; Khajornrungruan, Panart; Hiyama, Hirokuni; Mochizuki, Yoshihiro
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology

69

TaN Cup Formation by CMP for Cross-Spacered Phase Change Memory

Authors:
Lin, Ke-Chin; Chen, Chih-Wei; Wang, Shih-Hui; Shu, Dun-Ying; Kao, Ming-Jer; Tsai, Ming-Jinn
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology

70

The Fabrication of Ideal Diamond Disk (IDD) by Casting Diamond Film on Silicon wafer

Authors:
Sung, James C.; Sung, James C.; Sung, James C.; Chen, Ying-Tung; Kan, Ming-Chi; Chang, Hsiao-Kuo; Sung, Michael
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology

71

The Organic Diamond Disk (ODD) for Dressing Polishing Pads of Chemical Mechanical Planarization

Authors:
Sung, James C.; Sung, James C.; Sung, James C.; Chou, Cheng-Shiang; Pai, Yang-Liang; Sung, Michael
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology

72

The Study of CVD diamond conditioner

Authors:
Rikita, Naoki; Matsuki, Ryuichi; Kobayashi, Hiroyuki; Nakamura, Masato; Chida, Kasumi
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology

73

Three-Dimensional Metrology for CMP process evaluation with In-line Wide-Area Atomic Force Microscope

Authors:
Murayama, Ken; Morimoro, Takafumi; Kunitomo, Yuichi; Edamura, Manabu; Sekino, Satoshi; Kurenuma, Toru
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology

74

Tribological, Kinetic, Thermal and Flow Characteristics of PPS and PEEK Retaining Rings

Authors:
Wei, X.; Philipossian, A.; Philipossian, A.; Sampurno, Y.; Sudargho, F.; Sudargho, F.; Zhuang, Y.; Zhuang, Y.; Wargo, C.; Borucki, L.
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology

75

Voltage-Activated Electrochemical Reactions of Copper for Electrochemical Mechanical Polishing (ECMP) Application

Authors:
Seo, Yong-Jin; Park, Sung-Woo; Han, Sang-Jun; Lee, Young-Kyun; Lee, Woo-Sun
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology

76

Wafer edge / bevel treatment of device wafers by means of CMP

Authors:
Wieters, Anngret; Thieme, Peter
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology