1
A 600V GaN-on-Si Power IC with Integrated Gate Driver, Freewheeling Diode, Temperature and Current Sensors and Auxiliary Devices
Autoren:
Moench, Stefan; Reiner, Richard; Waltereit, Patrick; Hueckelheim, Jan; Meder, Dirk; Quay, Ruediger; Ambacher, Oliver; Kallfass, Ingmar
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
2
A General Model Translation Approach for Vertical Power MOSFETs Based on BSIM3 Model
Autoren:
Yan, Lixi; Kallfass, Ingmar
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
3
A Method for the Characterization of Adhesion Strength Degradation of Thin Films on Si-Substrate under Thermal Cycling Test
Autoren:
Zhao, Dawei; Letz, Sebastian; Schletz, Andreas; Maerz, Martin
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
4
A New Development of Micro-Copper Sinter Material for High Power Electronics Application
Autoren:
Schwarzer, Christian; Chew, Ly May; Stoll, Thomas; Franke, Joerg; Kaloudis, Michael
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
5
A Review on the Application of On-line Von (On-State Voltage) Sens-ing for Junction Temperature Estimation of Power Semiconductor Modules
Autoren:
Degrenne, Nicolas; Brandelero, Julio; Kawahara, Chihiro; Mollov, Stefan
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
6
Analysis of the gate driver stray inductance in a Vienna rectifier through parametric Electromagnetic simulations
Autoren:
Palomba, Francesco; Gennaro, Francesco; Pavone, Mario; Aiello, Giuseppe; Cacciato, Mario; Muff, Simon; Eichinger, Ludwig
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
7
Application considerations for Double Sided Cooled Modules in Automotive Environment
Autoren:
Moeller, Sebastian; Karimi, Danial; Vanegas, Omar; El Baghdadi, Mohamed; Kospach, Alexander; Lis, Adrian; Rabl, Benedikt; Hegazy, Omar; Abart, Christoph
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
8
Application of Neural Networks to Accelerate Thermomechanical Simulations of Power Modules for Lifetime Prediction
Autoren:
Acuna, Javier; Afanasenko, Valentyna; Rupp, Thomas; Sonner, Marcus; Klingler, Markus; Kallfass, Ingmar
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
9
Application of response surface methodology for optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging
Autoren:
Yu, Zechun; Zeng, Weijian; Bayer, Christoph Friedrich; Schletz, Andreas; Maerz, Martin
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
10
Characterization of the Junction Temperature of SiC Power Devices via Quasi-Threshold Voltage as Temperature Sensitive Electrical Parameter
Autoren:
Sharma, Kanuj; Baron, Kevin Munoz; Ruthardt, Johannes; Hueckelheim, Jan; Kocha, Dominik; Muenzenmayer, Florian; Kallfass, Ingmar
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
11
Comparative study of determining junction temperature of SiC MOSFETs during power cycling tests by a Tj sensor and the VSD(T)-method
Autoren:
Kempiak, Carsten; Lindemann, Andreas; Idaka, Shiori; Thal, Eckhard
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
12
Comparison of Silver Sintered Assemblies on Non-DCB Substrates
Autoren:
Subbiah, Nilavazhagan; Schiffmacher, Alexander; Song, Xiayingfang; Wilde, Juergen
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
13
Control scheme for EMI reduction via spread spectrum modulation for triangular current mode (TCM) DC/DC converters
Autoren:
Ulrich, Burkhard
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
14
Copper wire bonding process characterization and simulation
Autoren:
Mancaleoni, Alberto; Sitta, Alessandro; Colombo, Alexandra; Villa, Riccardo; Mirone, Giuseppe; Renna, Marco; Calabretta, Michele
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
15
Deformation Measurements during Active Operation of Power Modules with Novel Assembly and Packaging Technology
Autoren:
Schiffmacher, Alexander; Qelibari, Arben; Rudzki, Jacek; Osterwald, Frank; Wilde, Juergen
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
16
Design and integration of inductive components for a high-frequency 11 kW / 800 V off-board charger for electric vehicl
Autoren:
Schmidhuber, Michael; Drexler, Christoph; Ditze, Stefan; Joffe, Christopher; Ehrlich, Stefan; Arndt, Bastian; Olbrich, Peter; Reindl, Hartwig
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
17
Design of Interleaved GaN Transistor Based Buck Converter with Directly Coupled Foil Winding Inductor
Autoren:
Kroics, Kaspars
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
18
Design, Manufacturing and Evaluation of a Highly Integrated Low-Voltage High-Current Inverter
Autoren:
Le Lesle, Johan; Quemener, Vincent; Morrand, Julien; Perrin, Remi; Mrad, Roberto; Mollov, Stefan
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
19
Detecting Three-Phase Power Inverter Output Currents By A Single PCB Current Sensor
Autoren:
Bat-Ochir, Bat-Otgon; Bayarkhuu, Battuvshin; Tsukuda, Masanori; Dugarjav, Bayasgalan; Omura, Ichiro
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
20
Development of sinter paste with surface modified copper alloy particles for die-attach bonding
Autoren:
Bhogaraju, Sri Krishna; Conti, Fosca; Schmid, Maximilian; Meier, Markus R.; Schweigart, Helmut; Elger, Gordon
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems