21
Fault tolerant drives for aerospace applications
Autoren:
Atkinson, G. J.; Bennett, J. W.; Mecrow, B. C.; Atkinson, D. J.; Jack, A. G.; Pickert, V.
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
22
First Power Cycling Results of Improved Packaging Technologies for Hybrid Electrical Vehicle Applications
Autoren:
Hensler, Alexander; Lutz, Josef; Thoben, Markus; Guth, Karsten
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
23
Future Role of Power Electronics
Autoren:
Omura, Ichiro
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
24
High Temperature Electronics for High Power Density DC-DC Converters and Motor Drives
Autoren:
Delatte, Pierre; Dessard, Vincent; Saib, Aimad; Pequignot, Nicolas; Picún, Gonzalo; Demeûs, Laurent; Doucet, Jean-Christophe; Krebs, Thomas
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
25
High-Density System Integration for Medium Power Applications
Autoren:
Boroyevich, Dushan; Chen, Zheng; Luo, Fang; Ngo, Khai; Ning, Puqi; Wang, Ruxi; Zhang, Di; Wang, Fred; Burgos, Rolando; Lai, Rixin; Wang, Shuo
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
26
How Materials Behaviour affects Power Electronics Reliability
Autoren:
Poech, Max H.
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
27
Importance of Boundary Conditions for Optimizing the Thermal Dimensioning of PCB Traces
Autoren:
Coppola, L.; Agostini, B.; Schmidt, R.; Barcelos, R. Faria
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
28
Inductive Parasitics in Power Semiconductor Modules subject to Multi-Objective Optimisation
Autoren:
Förster, Stefan; Lindemann, Andreas
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
29
Innovative materials of automotive power packaging
Autoren:
Tan, Ky Lim; Vivet, Laurent; Morelle, Jean Michel; Pierre, Bertrand; Bienvenu, Yves; Kaabi, Abderrahmen
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
30
Insulating IGBT Driver with PCB integrated capacitive coupling elements
Autoren:
Zeltner, Stefan
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
31
Integrable Semiconductor Current Balancer for Paralleled Fluorescent Lamps
Autoren:
Weger, Robert
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
32
Integrated gate driver circuit solutions
Autoren:
Herzer, R.
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
33
Integrated rectenna circuit for microwave power scavenging
Autoren:
Merabet, Boubekeur; Takhedmit, Hakim; Allard, Bruno; Cirio, Laurent; Costa, François; Picon, Odile; Vollaire, Christian
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
34
Interface Degradation of Al Heavy Wire Bonds on Power Semiconductors during Active Power Cycling measured by the Shear Test
Autoren:
Goehre, Jens; Schneider-Ramelow, Martin; Geißler, Ute; Lang, Klaus-Dieter
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
35
Investigation and PEEC Based Simulation of Radiated Emissions Produced by Power Electronic Converters
Autoren:
Domurat-Linde, André; Hoene, Eckart
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
36
Is it the End of the Road for Silicon in Power Conversion?
Autoren:
Lidow, Alex
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
37
Knowledge Matrix for Power Electronics – The Approach of the ZVEI Working Group 'High Temperature and Power Electronics'
Autoren:
Rittner, Martin; Roth, Alexander
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
38
Low temperature sinter technology - Die attachment for power electronic applications
Autoren:
Göbl, C.; Faltenbacher, J.
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
39
Mechanical Characterization of an Au-Ge Solder Alloy for High Temperature Electronic Devices
Autoren:
Msolli, Sabeur; Dalverny, Olivier; Alexis, Joel; Karama, Moussa
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
40
Mixed switched mode and linear Lithium Ion Battery Tester for high Power and large Bandwidth
Autoren:
Fischnaller, M.; Melbert, J.
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems