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21

Fault tolerant drives for aerospace applications

Autoren:
Atkinson, G. J.; Bennett, J. W.; Mecrow, B. C.; Atkinson, D. J.; Jack, A. G.; Pickert, V.
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

22

First Power Cycling Results of Improved Packaging Technologies for Hybrid Electrical Vehicle Applications

Autoren:
Hensler, Alexander; Lutz, Josef; Thoben, Markus; Guth, Karsten
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

23

Future Role of Power Electronics

Autoren:
Omura, Ichiro
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

24

High Temperature Electronics for High Power Density DC-DC Converters and Motor Drives

Autoren:
Delatte, Pierre; Dessard, Vincent; Saib, Aimad; Pequignot, Nicolas; Picún, Gonzalo; Demeûs, Laurent; Doucet, Jean-Christophe; Krebs, Thomas
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

25

High-Density System Integration for Medium Power Applications

Autoren:
Boroyevich, Dushan; Chen, Zheng; Luo, Fang; Ngo, Khai; Ning, Puqi; Wang, Ruxi; Zhang, Di; Wang, Fred; Burgos, Rolando; Lai, Rixin; Wang, Shuo
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

26

How Materials Behaviour affects Power Electronics Reliability

Autoren:
Poech, Max H.
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

27

Importance of Boundary Conditions for Optimizing the Thermal Dimensioning of PCB Traces

Autoren:
Coppola, L.; Agostini, B.; Schmidt, R.; Barcelos, R. Faria
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

28

Inductive Parasitics in Power Semiconductor Modules subject to Multi-Objective Optimisation

Autoren:
Förster, Stefan; Lindemann, Andreas
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

29

Innovative materials of automotive power packaging

Autoren:
Tan, Ky Lim; Vivet, Laurent; Morelle, Jean Michel; Pierre, Bertrand; Bienvenu, Yves; Kaabi, Abderrahmen
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

30

Insulating IGBT Driver with PCB integrated capacitive coupling elements

Autoren:
Zeltner, Stefan
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

31

Integrable Semiconductor Current Balancer for Paralleled Fluorescent Lamps

Autoren:
Weger, Robert
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

32

Integrated gate driver circuit solutions

Autoren:
Herzer, R.
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

33

Integrated rectenna circuit for microwave power scavenging

Autoren:
Merabet, Boubekeur; Takhedmit, Hakim; Allard, Bruno; Cirio, Laurent; Costa, François; Picon, Odile; Vollaire, Christian
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

34

Interface Degradation of Al Heavy Wire Bonds on Power Semiconductors during Active Power Cycling measured by the Shear Test

Autoren:
Goehre, Jens; Schneider-Ramelow, Martin; Geißler, Ute; Lang, Klaus-Dieter
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

35

Investigation and PEEC Based Simulation of Radiated Emissions Produced by Power Electronic Converters

Autoren:
Domurat-Linde, André; Hoene, Eckart
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

36

Is it the End of the Road for Silicon in Power Conversion?

Autoren:
Lidow, Alex
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

37

Knowledge Matrix for Power Electronics – The Approach of the ZVEI Working Group 'High Temperature and Power Electronics'

Autoren:
Rittner, Martin; Roth, Alexander
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

38

Low temperature sinter technology - Die attachment for power electronic applications

Autoren:
Göbl, C.; Faltenbacher, J.
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

39

Mechanical Characterization of an Au-Ge Solder Alloy for High Temperature Electronic Devices

Autoren:
Msolli, Sabeur; Dalverny, Olivier; Alexis, Joel; Karama, Moussa
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

40

Mixed switched mode and linear Lithium Ion Battery Tester for high Power and large Bandwidth

Autoren:
Fischnaller, M.; Melbert, J.
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems