Anzeige
Sortierung
Seite 1 von 4

1

A Novel Evaluation Method of Polishing Slurry Flow Using Digital Image Processing - Mechanical Polishing for Sapphire Using Diamond Slurry

Autoren:
Uneda, Michio; Fukuta, Yuya; Hotta, Kazutoshi; Sugiyama, Hiroyasu
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

2

A Study on the Damaged Layer Characteristic of Wafer by using Chemical-Mechanical Polishing

Autoren:
Park, Chuljin; Jeon, Minhyon; Lee, Sangjik; Kim, Doyeon; Lee, Taekyung; Kim, Hyoungjae
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

3

Additive/Abrasive Interactions in Solution: Investigation of the Surface Chemistry and Adsorption Behaviour of CMP Abrasives

Autoren:
England, Ashley N.; Rawat, Ashwani; Moinpour, Mansour; Remsen, Edward E.
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

4

Adsorption Mechanism of Benzotriazole on Copper Surface in CMP Based Slurries Containing Peroxide and Glycine

Autoren:
Li, Jing; Lu, Xinchun; Ou, Junyu; Cheng, Jie
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

5

Advances in CMP for TSV Reveal

Autoren:
Rhoades, Robert L.; Malta, Dean
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

6

Application of an Abrasive-Free Cu Slurry for MEMS Devices

Autoren:
Steible, Benjamin; Stoldt, Michael; Tack, Michael; Zwicker, Gerfried
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

7

Biomaterials Applications of Chemical Mechanical Polishing

Autoren:
Basim, G. Bahar; Ozdemir, Zeynep; Mutlu, Ozal
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

8

Buried Tungsten Metal Gate Formation with Chemical Mechanical Polishing Technique and Involved Issues

Autoren:
Hwang, Kyungho; Kwon, Hyuk; Kim, Hyunghwan; Kang, Hyosang
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

9

Challenges of CMP Consumables Metrology

Autoren:
Tregub, A.; Rawat, A.
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

10

Chemical Mechanical Planarization (CMP) In-Situ pad groove monitor through Fault Detection and Classification (FDC) system

Autoren:
Del Monaco, S.; Calderone, F.; Fritah, M.; Tiec, T. Le; Laurent, A.
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

11

Chemical Mechanical Polishing Slurry for Aluminum Substrate

Autoren:
Wang, Liangyong; Liu, Weili; Song, Zhitang
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

12

Chemical-Mechanical Planarization of Aluminium Damascene Structures

Autoren:
Künzelmann, U.; Mueller, M. R.; Kallis, K. T.; Schuette, F.; Menzel, S.; Engels, S.; Fong, J.; Lin, C.; Dysard, J.; Bartha, J. W.; Knoch, J.
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

13

CMP Defect Monitoring in HKMG Loop on Monitor Wafers

Autoren:
Peng, Ren; Hsu, Chun Wei; Hsieh, Duckblood; Lin, Welch; Huang, Climbing; Wu, JY; Palamadai, Chandar; Sapre, Prasanna; Chang, Timothy; Wang, Tony; Huang, Eros; Cheng, Harvey; Hu, Debbie
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

14

CMP Evaluation of Reusable Polishing Pad using Auxiliary Plate

Autoren:
Daventure, Nicolas; Del Monaco, Silvio; Suzuki, Tatsutoshi; Balan, Viorel; Rivoire, Maurice
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

15

CMP process development for high mobility channel materials

Autoren:
Ong, Patrick; Gillot, Christophe; Ansar, Sheik; Noller, Bastian
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

16

CMP Process Optimization for Bonding Applications

Autoren:
Balan, Viorel; Seignard, Aurélien; Scevola, Daniel; Lugand, Jean-François; Di Cioccio, Léa; Rivoire, Maurice
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

17

Correlation of Polishing Pad Property and Pad Debris on Scratch Formation during CMP

Autoren:
Kwon, Tae-Young; Cho, Byoung-Jun; Venkatesh, R. Prasanna; Park, Jin-Goo
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

18

Cu Layer thickness monitoring in CMP process by using eddy current sensor

Autoren:
Qu, Zilian; Zhao, Qian; Yu, Qiang; Zhao, Dewen; Li, Hongkai; Lu, Xinchun; Meng, Yonggang
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

19

CVD Diamond-Coated CMP Polishing Pad Conditioner With Asperity Height Variation

Autoren:
Choi, Joo Hoon; Lee, Yong Bin; Kim, Byung Ki
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology

20

Determination of Adhesion Force of Particles on Substrate Surface using Atomic Force Microscopy

Autoren:
Shin, Woonki; An, Joonho; Kim, Jiyoon; Jeong, Haedo
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology