1
A Novel Evaluation Method of Polishing Slurry Flow Using Digital Image Processing - Mechanical Polishing for Sapphire Using Diamond Slurry
Autoren:
Uneda, Michio; Fukuta, Yuya; Hotta, Kazutoshi; Sugiyama, Hiroyasu
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
2
A Study on the Damaged Layer Characteristic of Wafer by using Chemical-Mechanical Polishing
Autoren:
Park, Chuljin; Jeon, Minhyon; Lee, Sangjik; Kim, Doyeon; Lee, Taekyung; Kim, Hyoungjae
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
3
Additive/Abrasive Interactions in Solution: Investigation of the Surface Chemistry and Adsorption Behaviour of CMP Abrasives
Autoren:
England, Ashley N.; Rawat, Ashwani; Moinpour, Mansour; Remsen, Edward E.
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
4
Adsorption Mechanism of Benzotriazole on Copper Surface in CMP Based Slurries Containing Peroxide and Glycine
Autoren:
Li, Jing; Lu, Xinchun; Ou, Junyu; Cheng, Jie
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
5
Advances in CMP for TSV Reveal
Autoren:
Rhoades, Robert L.; Malta, Dean
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
6
Application of an Abrasive-Free Cu Slurry for MEMS Devices
Autoren:
Steible, Benjamin; Stoldt, Michael; Tack, Michael; Zwicker, Gerfried
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
7
Biomaterials Applications of Chemical Mechanical Polishing
Autoren:
Basim, G. Bahar; Ozdemir, Zeynep; Mutlu, Ozal
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
8
Buried Tungsten Metal Gate Formation with Chemical Mechanical Polishing Technique and Involved Issues
Autoren:
Hwang, Kyungho; Kwon, Hyuk; Kim, Hyunghwan; Kang, Hyosang
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
9
Challenges of CMP Consumables Metrology
Autoren:
Tregub, A.; Rawat, A.
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
10
Chemical Mechanical Planarization (CMP) In-Situ pad groove monitor through Fault Detection and Classification (FDC) system
Autoren:
Del Monaco, S.; Calderone, F.; Fritah, M.; Tiec, T. Le; Laurent, A.
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
11
Chemical Mechanical Polishing Slurry for Aluminum Substrate
Autoren:
Wang, Liangyong; Liu, Weili; Song, Zhitang
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
12
Chemical-Mechanical Planarization of Aluminium Damascene Structures
Autoren:
Künzelmann, U.; Mueller, M. R.; Kallis, K. T.; Schuette, F.; Menzel, S.; Engels, S.; Fong, J.; Lin, C.; Dysard, J.; Bartha, J. W.; Knoch, J.
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
13
CMP Defect Monitoring in HKMG Loop on Monitor Wafers
Autoren:
Peng, Ren; Hsu, Chun Wei; Hsieh, Duckblood; Lin, Welch; Huang, Climbing; Wu, JY; Palamadai, Chandar; Sapre, Prasanna; Chang, Timothy; Wang, Tony; Huang, Eros; Cheng, Harvey; Hu, Debbie
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
14
CMP Evaluation of Reusable Polishing Pad using Auxiliary Plate
Autoren:
Daventure, Nicolas; Del Monaco, Silvio; Suzuki, Tatsutoshi; Balan, Viorel; Rivoire, Maurice
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
15
CMP process development for high mobility channel materials
Autoren:
Ong, Patrick; Gillot, Christophe; Ansar, Sheik; Noller, Bastian
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
16
CMP Process Optimization for Bonding Applications
Autoren:
Balan, Viorel; Seignard, Aurélien; Scevola, Daniel; Lugand, Jean-François; Di Cioccio, Léa; Rivoire, Maurice
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
17
Correlation of Polishing Pad Property and Pad Debris on Scratch Formation during CMP
Autoren:
Kwon, Tae-Young; Cho, Byoung-Jun; Venkatesh, R. Prasanna; Park, Jin-Goo
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
18
Cu Layer thickness monitoring in CMP process by using eddy current sensor
Autoren:
Qu, Zilian; Zhao, Qian; Yu, Qiang; Zhao, Dewen; Li, Hongkai; Lu, Xinchun; Meng, Yonggang
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
19
CVD Diamond-Coated CMP Polishing Pad Conditioner With Asperity Height Variation
Autoren:
Choi, Joo Hoon; Lee, Yong Bin; Kim, Byung Ki
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
20
Determination of Adhesion Force of Particles on Substrate Surface using Atomic Force Microscopy
Autoren:
Shin, Woonki; An, Joonho; Kim, Jiyoon; Jeong, Haedo
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology