1
Design of Photovoltaic Microinverter for Off-Grid and Grid-Parallel Applications
Autoren:
Felgemacher, Christian; Jaeger, Philipp; Kobeissi, Ali; Pfeiffer, Jonas; Wiegand, Dennis; Kruschel, Wolfram; Dombert, Benjamin; Vasconcelos Araújo, Samuel; Zacharias, Peter
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
2
Development of a New 1000 V / 1 MVA IGBT 3L-NPC-VSC PEBB Type 2 with Independent Modulation, DC-Link Balancing and Short-Circuit Protection
Autoren:
Staudt, Ingo; Sprenger, Michael
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
3
Developments for Copper-Graphite Composite Thermal Cores for PCBs for High-Reliability RF Systems
Autoren:
Saums, David L.; Hay, Robert A.
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
4
Efficient online-algorithm for the temperature cycle recording of an IGBT power module in a hybrid car during inverter operation
Autoren:
Denk, Marco; Bakran, Mark-M.
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
5
Electro – Thermal Simulations and Experimental Results on the Surge – Current Capability of 1200 V SiC MPS Diodes
Autoren:
Fichtner, Susanne; Lutz, Josef; Basler, Thomas; Rupp, Roland; Gerlach, Rolf
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
6
Evolution of Electrical Performance in New Generation of SiC MOSFET for High Temperature Applications
Autoren:
Ouaida, Rémy; Calvez, Cyril; Podlejski, Anne-Sophie; Brosselard, Pierre; Ouaida, Rémy
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
7
Flexible switching speed control to improve switching losses and EMI by a gate driver with adjustable gate current
Autoren:
Bauch, Julia; Lindemann, Andreas
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
8
Foil Based Transient Liquid Phase Bonding as a Die-Attachment Method for High Temperature Devices
Autoren:
Bajwa, A. A.; Qin, Y. Y.; Zeiser, R.; Wilde, J,
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
9
GaN Power Semiconductors for PV Inverter Applications – Opportunities and Risks
Autoren:
Stubbe, Thorsten; Mallwitz, Regine; Rupp, Roland; Pozzovivo, Gianmauro; Bergner, Wolfgang; Haeberlen, Oliver; Kunze, Mike
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
10
High resolution failure analysis of silver-sintered contact interfaces for power electronics
Autoren:
Boettge, Bianca; Maerz, Benjamin; Schischka, Jan; Klengel, Sandy; Petzold, Matthias
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
11
High Temperature Compatibility of Interface between Al Ribbon and Au finished DBC Substrate
Autoren:
Park, Semin; Nagao, Shijo; Suganuma, Katsuaki
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
12
High Temperature Discrete Integrated Coreless Signal Insulator
Autoren:
Bergogne, Dominique; Martin, Christian; Allard, Bruno; El Falahi, Khalil; Picun, Gonzalo; Ezzeddine, Hilal; Pintout, Cedric
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
13
High-throughput DBC-assembled IGBT screening for power module
Autoren:
Tsukuda, Masanori; Okoda, Seiichi; Noda, Ryuzo; Tashiro, Katsuji; Omura, Ichiro; Tsukuda, Masanori
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
14
Impact of the control on the size of the output capacitor in the integration of Buck converters
Autoren:
Cortes, Jorge; Švikovic, Vladimir; Alou, Pedro; Oliver, Jesús A.; Cobos, José A.
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
15
Improved thermal cycling reliability of ZTA (Zirconia Toughened Alumina) DBC substrates by manipulating metallization properties
Autoren:
Park, Junhee; Kim, Minseok; Roth, Alexander
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
16
Improving the bond strength of sinter joints by modifying the DBC without noble finishes and modified silver sinter pastes
Autoren:
Roth, Alexander; Schmitt, Wolfgang
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
17
Influence of Cu/Ni(P) Metallized Si3N4 Ceramic Substrate in Bond Reliability of Power Components at 250 °C
Autoren:
Lang, Fengqun; Yamaguchi, Hiroshi; Nakagawa, Hiroshi; Sato, Hiroshi
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
18
Influence of nickel-phosphorus surface roughness on both wettability and pores formation in solder joints for high power electronic applications
Autoren:
Vivet, L.; Joudrier, A.-L.; Tan, K.-L.; Morelle, J.-M.; Etcheberry, A.; Chalumeau, L.
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
19
Integrated gate driver circuits with an ultra-compact design and high level of galvanic isolation for power transistors
Autoren:
To, N.-D.; Rouger, N.; Arnould, J.-D.; Corrao, N.; Crebier, J.-C.; Lembeye, Y.
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
20
Internal degradation monitoring of power devices during power cycling test
Autoren:
Watanabe, Akihiko; Tsukuda, Masahiro; Omura, Ichiro
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems