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1

A 600V GaN-on-Si Power IC with Integrated Gate Driver, Freewheeling Diode, Temperature and Current Sensors and Auxiliary Devices

Autoren:
Moench, Stefan; Reiner, Richard; Waltereit, Patrick; Hueckelheim, Jan; Meder, Dirk; Quay, Ruediger; Ambacher, Oliver; Kallfass, Ingmar
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

2

A General Model Translation Approach for Vertical Power MOSFETs Based on BSIM3 Model

Autoren:
Yan, Lixi; Kallfass, Ingmar
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

3

A Method for the Characterization of Adhesion Strength Degradation of Thin Films on Si-Substrate under Thermal Cycling Test

Autoren:
Zhao, Dawei; Letz, Sebastian; Schletz, Andreas; Maerz, Martin
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

4

A New Development of Micro-Copper Sinter Material for High Power Electronics Application

Autoren:
Schwarzer, Christian; Chew, Ly May; Stoll, Thomas; Franke, Joerg; Kaloudis, Michael
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

5

A Review on the Application of On-line Von (On-State Voltage) Sens-ing for Junction Temperature Estimation of Power Semiconductor Modules

Autoren:
Degrenne, Nicolas; Brandelero, Julio; Kawahara, Chihiro; Mollov, Stefan
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

6

Analysis of the gate driver stray inductance in a Vienna rectifier through parametric Electromagnetic simulations

Autoren:
Palomba, Francesco; Gennaro, Francesco; Pavone, Mario; Aiello, Giuseppe; Cacciato, Mario; Muff, Simon; Eichinger, Ludwig
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

7

Application considerations for Double Sided Cooled Modules in Automotive Environment

Autoren:
Moeller, Sebastian; Karimi, Danial; Vanegas, Omar; El Baghdadi, Mohamed; Kospach, Alexander; Lis, Adrian; Rabl, Benedikt; Hegazy, Omar; Abart, Christoph
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

8

Application of Neural Networks to Accelerate Thermomechanical Simulations of Power Modules for Lifetime Prediction

Autoren:
Acuna, Javier; Afanasenko, Valentyna; Rupp, Thomas; Sonner, Marcus; Klingler, Markus; Kallfass, Ingmar
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

9

Application of response surface methodology for optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging

Autoren:
Yu, Zechun; Zeng, Weijian; Bayer, Christoph Friedrich; Schletz, Andreas; Maerz, Martin
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

10

Characterization of the Junction Temperature of SiC Power Devices via Quasi-Threshold Voltage as Temperature Sensitive Electrical Parameter

Autoren:
Sharma, Kanuj; Baron, Kevin Munoz; Ruthardt, Johannes; Hueckelheim, Jan; Kocha, Dominik; Muenzenmayer, Florian; Kallfass, Ingmar
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

11

Comparative study of determining junction temperature of SiC MOSFETs during power cycling tests by a Tj sensor and the VSD(T)-method

Autoren:
Kempiak, Carsten; Lindemann, Andreas; Idaka, Shiori; Thal, Eckhard
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

12

Comparison of Silver Sintered Assemblies on Non-DCB Substrates

Autoren:
Subbiah, Nilavazhagan; Schiffmacher, Alexander; Song, Xiayingfang; Wilde, Juergen
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

13

Control scheme for EMI reduction via spread spectrum modulation for triangular current mode (TCM) DC/DC converters

Autoren:
Ulrich, Burkhard
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

14

Copper wire bonding process characterization and simulation

Autoren:
Mancaleoni, Alberto; Sitta, Alessandro; Colombo, Alexandra; Villa, Riccardo; Mirone, Giuseppe; Renna, Marco; Calabretta, Michele
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

15

Deformation Measurements during Active Operation of Power Modules with Novel Assembly and Packaging Technology

Autoren:
Schiffmacher, Alexander; Qelibari, Arben; Rudzki, Jacek; Osterwald, Frank; Wilde, Juergen
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

16

Design and integration of inductive components for a high-frequency 11 kW / 800 V off-board charger for electric vehicl

Autoren:
Schmidhuber, Michael; Drexler, Christoph; Ditze, Stefan; Joffe, Christopher; Ehrlich, Stefan; Arndt, Bastian; Olbrich, Peter; Reindl, Hartwig
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

17

Design of Interleaved GaN Transistor Based Buck Converter with Directly Coupled Foil Winding Inductor

Autoren:
Kroics, Kaspars
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

18

Design, Manufacturing and Evaluation of a Highly Integrated Low-Voltage High-Current Inverter

Autoren:
Le Lesle, Johan; Quemener, Vincent; Morrand, Julien; Perrin, Remi; Mrad, Roberto; Mollov, Stefan
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

19

Detecting Three-Phase Power Inverter Output Currents By A Single PCB Current Sensor

Autoren:
Bat-Ochir, Bat-Otgon; Bayarkhuu, Battuvshin; Tsukuda, Masanori; Dugarjav, Bayasgalan; Omura, Ichiro
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

20

Development of sinter paste with surface modified copper alloy particles for die-attach bonding

Autoren:
Bhogaraju, Sri Krishna; Conti, Fosca; Schmid, Maximilian; Meier, Markus R.; Schweigart, Helmut; Elger, Gordon
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems