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81

SiCmodul - Modular high-temperature SiC power electronics for fail-safe power control in electrical drive engineering

Autoren:
Marczok, Christoph; Martina, Manuel; Laumen, Michael; Richter, Sebastian; Birkhold, Andreas; Flieger, Bjoern; Wendt, Oliver; Paesler, Thomas
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

82

Simple and Precise Calorimetry Method for Evaluation of Losses in Power Electronic Converters

Autoren:
Mary, Nicolas; Perrin, Remi; Mollov, Stefan; Buttay, Cyril
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

83

Simultaneous Imaging of Strain and Temperature using Single IR Camera

Autoren:
Masuda, Yoshiki; Watanabe, Akihiko; Omura, Ichiro
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

84

Sintered-copper Die-attach: Processing, Properties, and Reliability

Autoren:
Wang, Meiyu; Shan, Yanliang; Mei, Yunhui; Li, Xin; Lu, Guo-Quan
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

85

Smart Ultrasonic Welding in Power Electronics Packaging

Autoren:
Hunstig, Matthias; Schaermann, Waldemar; Broekelmann, Michael; Holtkaemper, Sebastian; Siepe, Dirk; Hesse, Hans J.
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

86

Study and Design of an Integrated CMOS Laser Diode Driver for an iToF-based 3D Image Sensor

Autoren:
David, Romain; Allard, Bruno; Branca, Xavier; Joubert, Charles
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

87

Surface-Mount Package IPM with Highly Reliable Transfer Molding Resin

Autoren:
Hodaka, Rokubuichi,; Harada, Hiroyuki; Sakamoto, Ken; Iwai, Takamasa; Kosugi, Akira; Shikano, Taketoshi; Hiramatsu, Seiki
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

88

Survey on Generative and Discriminative Fault Detection Approaches with Focus on SiC Components

Autoren:
Loghmani Moghaddam Toussi, Afshin; Bahman, Amir Sajjad; Blaabjerg, Frede
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

89

Switching speed evaluation of e-mode GaN HEMTs in ultra-low inductive switching cell designs

Autoren:
Risch, Raffael; Hu, Anliang; Biela, Juergen
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

90

System integration and analysis of SiC-based high power inverter with up to 250 kW and switching slopes of up to 50 kV/μs for novel powertrain concepts

Autoren:
De Doncker, Rik W.; Fuchs, Lea; Hepp, Maximilian; Luedecke, Christoph; Meyne, Christian; Nisch, Alexander; Otto, Alexander; Reum, Thomas; Rzepka, Sven; Strenger, Christian; Uhlemann, Andre; Vanegas, Omar; Wondrak, Wolfgang
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

91

The Opportunities of Integration Technologies for Active and Passive Components

Autoren:
Ostmann, Andreas; Hoene, Eckart; Marczok, Christoph
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

92

Thermal Analysis of Power Module with Double Sided Direct Cooling using Ceramic Heat Sinks

Autoren:
Botter, Nicolas; Avenas, Yvan; Missiaen, Jean-Michel; Bouvard, Didier; Khazaka, Rabih
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

93

Thermal Simulation for Power Density Optimization of SiC-MOSFET Automotive Inverter

Autoren:
Becker, Nathalie; Bulovic, Sandro; Bittner, Roland; Herzer, Reinhard
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

94

Thermo-mechanical reliability of nanosilver sintered joints for large-area bonding

Autoren:
Dai, Jingru; Bello, Abubakar Umar; Agyakwa, Pearl; Cofield, Martin; Johnson, Christopher Mark
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

95

Thick film paste systems for multifunctional copper power modules

Autoren:
Reinhardt, Kathrin; Körner, Stefan; Partsch, Uwe
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

96

Thin-film Magnetics-on-Silicon Integrated Transformer for Isolated Signal and Power Coupling Applications

Autoren:
Pavlovic, Zoran; Podder, Pranay; Dobbyn, Dermot; Masood, Ansar; Wei, Guannan; Lordan, Daniel; McCloskey, Paul; O’Mathuna, Cian; O’Driscoll, Seamus
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

97

Three-State Output Gate Driver for IGBTs

Autoren:
Reigosa, Paula Diaz; Urcan, Bogdan Marian; Gascue, Martin Iriondo; Iannuzzo, Francesco
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

98

Two-layered planar SiC power module for industrial applications

Autoren:
Raab, Oliver; Kriegel, Kai; Ghesquiere, Pol
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

99

Ultra-Compact Combined Common Mode (CM)- and Differential Mode (DM)-Inductors

Autoren:
Deck, Patrick; Niessen, Martin; Dick, Christian P.
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

100

Ultra-high Power Density Server Supplies Employing GaN Power Semiconductors and PCB-Integrated Magnetics

Autoren:
Kasper, Matthias J.; Peluso, Luca; Deboy, Gerald; Knabben, Gustavo; Guillod, Thomas; Kolar, Johann W.
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems